High-heat radiation and low-noise circuit board

A low-noise, high-heat-dissipation technology, applied in printed circuits, electrical components, magnetic/electric field shielding, etc., can solve the problems of increasing space, weight and production cost

Inactive Publication Date: 2005-04-27
MINGWEI INVESTMENT
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is also necessary to add many devices to suppress electromagnetic interference (EMI) in the

Method used

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  • High-heat radiation and low-noise circuit board

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Embodiment Construction

[0043] The circuit board with high heat dissipation and low noise disclosed by the present invention makes the cooling speed of the circuit board faster through the structural design of the substrate, isolates electromagnetic interference phenomena, and avoids the use of adhesives.

[0044] Its circuit board structure uses metal plates as the base material of the circuit board. With the design of the substrate structure, the buffer surface with micro-holes is used to increase the adhesion of the insulating layer, and a metal covering layer is added to the structure. Its characteristic is that the entire metal substrate can be used to transmit the heat generated by the components, increasing the surface area for heat dissipation. The buffer surface of the insulating layer can increase the adhesion of the circuit layer to save the use of adhesives. Adding a metal covering layer in the circuit board structure can more effectively isolate electromagnetic interference phenomena. E...

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Abstract

The high heat dissipating and low noise circuit board has metal plate as base material and successively laminated insulating layer, circuit layer and covering metal layer. The complete metal base material can transmit the heat the modules in the circuit board produce and increase the heat dissipating area. The circuit board structure has insulating layer with buffering surface and the buffering surface has micropores to increase the adhesion of the circuit layer and reduce the amount of adhesive. The covering metal layer can block electromagnetic interference effectively.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board with high heat dissipation and low noise. Background technique [0002] In electronic system products, there are generally existing printed circuit boards (Printed Circuit Board, PCB) used to carry electronic components, which usually use a flat substrate composed of glass fiber cloth or a soft substrate. The disadvantage is that the thermal conductivity is not good, so Components on printed circuit boards require air as the heat transfer medium. However, heat dissipation by air conduction cannot quickly and effectively dissipate the heat accumulated in the components, which reduces the performance of the components and even reduces the life of the components. [0003] Therefore, adhesives and hot pressing are often used on printed circuit boards to attach materials with high thermal conductivity such as metal layers or copper foils to improve the thermal conductivity of printe...

Claims

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Application Information

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IPC IPC(8): H05K1/00H05K7/20H05K9/00
Inventor 刘明雄杨明祥朱源发洪陆麟
Owner MINGWEI INVESTMENT
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