Silicon wafer carrier
A carrier and silicon wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the cost reduction of solar power generation, and achieve the effects of firm positioning, cost saving, and less raw materials
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Embodiment 1
[0040] Using PVDF injection grade (produced by Ato company) as raw material, the shrinkage rate is 3%, and a 103mm square silicon chip carrier mold is designed. Ningbo Haitian HTF 250X / 1 injection machine is used, the injection temperature is 190°C-220°C, the injection pressure is 45-60MPa, and the mold temperature is 80°C.
Embodiment 2
[0042] Using PVDF injection grade (produced by Ato Company) as raw material, the shrinkage rate is 3%, and a 156mm square silicon chip carrier mold is designed. Ningbo Haitian HTF 250X / 1 injection machine is used, the injection temperature is 200℃~245℃, the injection pressure is 35~45MPa, and the mold temperature is 90℃.
Embodiment 3
[0044] Using PFA injection grade (produced by Daikin Corporation) as raw material, the shrinkage rate is 3%, and a 156mm square silicon chip carrier mold is designed. Ningbo Haitian HTF 250X / 1 injection machine is used, the injection temperature is 320°C-365°C, the injection pressure is 10-65MPa, and the mold temperature is 80°C.
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