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Disk-like member holding device

A component holding, disc-shaped technology, applied in the field of disc-shaped component holding devices, can solve the problems of reducing the design freedom of the production system, and the device does not want to be specialized, and achieves improved cooling efficiency, good positioning and retention, and improved tightness. The effect of sticking degree

Inactive Publication Date: 2005-07-13
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not preferred because it would cause undesired specialization of the device and reduce the degree of freedom in the design of the production system

Method used

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  • Disk-like member holding device
  • Disk-like member holding device
  • Disk-like member holding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] figure 1 A sputtering device side transfer arm 12 equipped with a holding device 10 for holding a disc-shaped substrate (disk-shaped element) 1 for sputtering processing according to an embodiment of the present invention is shown.

[0030] The holding device 10 has a bonding portion 11 for contacting the substrate 1 when holding (with a chuck) the disc-shaped substrate 1 having no through hole in the center. Such as figure 1 , image 3 As shown, the bonding surface 11A of the bonding portion 11 is formed into a concave shape, so that when the substrate 1 is pressed against the bonding portion 11 and is in close contact with the bonding surface 11A, the substrate 1 is deformed from The atmospheric side transfer arm 13 (described below) has a concave shape when viewed from the side. That is, it is deformed into a concave shape in the action d...

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PUM

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Abstract

The present invention provides a disk-shaped element holding device capable of performing good positioning and holding even a disk-shaped element without a through hole in the center. A bonding portion (1B) is provided on a substrate (1), and a bonding portion (11B) is provided at a bonding portion (11) on a substrate holding side. The substrate (1) is held on the holding device (10) via these joints. The outer peripheral portion of the substrate (1) is held by a mechanical chuck (15). The substrate (1) is held in a state deformed into a concave shape. In this way, good positioning can be maintained even for the substrate (1) having no through hole in the central part, and the uniformity of the quality of the thin film formed by sputtering can be improved. Also, the degree of close contact between the bonding surface (1A) and the bonding surface (11A) can be increased, thereby improving the cooling efficiency of the substrate (1) during the sputtering process.

Description

technical field [0001] The present invention relates to a holding device for a disc-shaped element, such as a holding device used when performing a certain process on a disc-shaped element, such as forming a thin film or the like. Background technique [0002] Various recording media (hereinafter simply referred to as discs) manufactured by forming various thin films on disc-shaped elements (or disc-shaped substrates) are known, for example, including CD discs such as CD, CD-R, and CD-RW. , DVD-RW, DVD-ROM and other optical discs such as DVD discs, and optical discs such as MO and MD. These disks are manufactured by laminating films by performing various processes such as sputtering treatment, spin coating treatment, etc. on a substrate made of, for example, polycarbonate or the like. [0003] The substrate used as the raw material of the disk is usually processed (for example, positioning and handling when moving into or out of a processing device, or during various proces...

Claims

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Application Information

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IPC IPC(8): G11B7/26C23C14/50C23C14/54G11B17/022H01L21/683H01L21/687
CPCC23C14/50C23C14/541G11B7/26G11B17/022H01L21/68785C23C14/34H01L21/68
Inventor 越川政人石崎秀树江本淳
Owner TDK CORPARATION