Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for delivery of substrate to film forming device for disk-like substrate, substrate delivery mechanism and substrate holder used for the method, and method of manufacturing disk-like recording

A substrate and carrier technology, which is used in the manufacture of optical record carriers, recording/reproducing by optical methods, and optical record carriers, etc., can solve problems such as warpage in the center part of the substrate

Inactive Publication Date: 2005-08-31
TDK CORPARATION
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as described above, the thin film formation process using a sputtering device and by using such a structure involves a problem that the central portion of the substrate may be warped, so this problem must be solved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for delivery of substrate to film forming device for disk-like substrate, substrate delivery mechanism and substrate holder used for the method, and method of manufacturing disk-like recording
  • Method for delivery of substrate to film forming device for disk-like substrate, substrate delivery mechanism and substrate holder used for the method, and method of manufacturing disk-like recording
  • Method for delivery of substrate to film forming device for disk-like substrate, substrate delivery mechanism and substrate holder used for the method, and method of manufacturing disk-like recording

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] Hereinafter, a substrate holder, a substrate transfer mechanism, etc. according to the present invention will be described in detail. figure 1 is a schematic sectional view showing the substrate carrier, an outer mask, an inner mask and an inner mask fixing magnet, the substrate carrier can be held together with the substrate by the transfer mechanism and used The substrate is actually held during thin film formation by a sputtering device or the like. also, figure 2 is a schematic cross-sectional view of an airside transfer arm with the substrate transfer mechanism positioned substantially opposite the substrate carrier holding the substrate and between the substrate transfer mechanism and the substrate carrier Pass the mask between racks. also, Figures 3 to 6 are schematic cross-sectional views each showing how substrate transfer is performed according to the above structure. In addition, FIG. 7 is a schematic cross-sectional view of a supply arm for substrates,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A substrate delivery method capable of holding a disk-like substrate without a center hole in the air and capable of easily transferring the substrate onto a spattering device, wherein projected parts are formed at both surface center parts of the disk-like substrate, the substrate is formed integrally of an outer mask covering the outer peripheral end part and the center part thereof, an inner mask holding the center of the substrate and fixed thereto, and an inner mask fixing magnet, a delivery mechanism holds the outer mask by a magnetic force and, at the same time, a substrate holder receiving the substrate holds the outer mask by the magnetic force, and the magnetic force on the delivery mechanism side is reduced at the time of delivery.

Description

technical field [0001] The present invention relates to a thin film forming apparatus for forming a thin film on a disk-shaped substrate. More particularly, the present invention relates to a method of transferring a disk-shaped substrate used in the apparatus to the apparatus, and a mechanism used in the method. In addition, the present invention also relates to a so-called substrate carrier used with the mechanism, and a disc-shaped recording medium manufacturing method for manufacturing a disc-shaped recording medium such as a so-called optical disc by using the mechanism. technical background [0002] Examples of recording media manufactured by forming various types of thin films on disc-shaped substrates, especially recording media having a disc-like shape include CD discs such as CD, CD-R or CD-RW and DVD discs Optical discs such as DVD-ROM or DVD-R; magneto-optical discs such as MO or MD; and various other types of discs. These discs are manufactured, for example, b...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C14/04C23C14/50G11B7/26H01L21/673
CPCG11B7/265G11B7/266C23C14/042C23C14/50
Inventor 越川政人渡边英昭
Owner TDK CORPARATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products