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MEMS pressure sensor chip level aging device

A pressure sensor and aging device technology, which is applied in the direction of measuring devices, fast-moving devices, microstructure devices, etc., can solve the problems of blank aging devices for MEMS pressure sensor chips, and achieve the effect of simple structure and easy operation

Inactive Publication Date: 2005-09-07
北京青鸟元芯微系统科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the problem that the aging device of the existing MEMS pressure sensor chip is still blank, the purpose of the present invention is to provide a MEMS pressure sensor chip level that is easy to operate, simple and practical, and can simultaneously perform pressure, temperature and electrical aging. Stress aging device

Method used

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  • MEMS pressure sensor chip level aging device

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Embodiment Construction

[0008] Such as figure 1 As shown, the present invention includes stainless steel cavity 3, end cap 2, sealing rubber ring 9, air inlet nozzle 5, air outlet nozzle 7, safety valve 4, electric heater 12, electric heater socket 6, fixed bracket 8 and other components , wherein the stainless steel cavity is made of seamless stainless steel pipe and stainless steel plate materials. The cavity 3 is cylindrical, and a stainless steel plate is welded to one end of the cavity by a sub-arc welding process as the bottom of the cavity 3, thereby sealing the end. The electric heater 12 is placed on the airtight end surface in the cavity 3, the electric heater socket 6 is correspondingly arranged outside the airtight end surface, and the air inlet nozzle 5, the air outlet nozzle 7 and the safety valve 4 are also respectively arranged on the outer end of the airtight end surface . The other end of the cavity 3 is provided with a flange 10, and the end cover 2 is connected to the flange 10 ...

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Abstract

The invention discloses a chip-level ageing device for MEMS pressure sensor, comprising stainless steel cavity, end cover, sealing rubber washer, air inlet, air outlet, safety valve, electric heater and its socket, fixed bracket, etc., where the stainless cavity is made of seamless stainless steel pipe and stainless steel sheet and composes a pressure ageing cavity by subarc welding technique; the pressure ageing cavity is cylindrical, the stainless steel sheet is welded at one end of the cavity and sealed, the electric heater is arranged on the airtight end surface in the cavity, the air inlet, air outlet, safety valve and electric heater socket are arranged outside the airtight end surface, the other end of the cavity is sealed by the end cover and the space between the end cover and the cavity is sealed by rubber pad. The fixed bracket is arranged on the wall of the cavity to firmly place the cylindrical cavity. The invention is simple in structure and easy to operate. And the invention can make electric, heat, air pressure ageing, etc., on the large wafer of the MEMS pressure sensor chip before cut and package.

Description

technical field [0001] The invention relates to an aging device for components, in particular to a chip-level aging device for MEMS (Micro-Electro-Mechanical Systems, micro-electro-mechanical systems) pressure sensors. Background technique [0002] At present, more and more attention has been paid to the aging of chips in the world. There have been some companies that produce professional chip-level aging equipment and devices. For example, the AREH company in the United States has designed special fixtures and aging devices. The aging device can be used for IC chips. Perform die burn-in. However, compared with IC chips, MEMS pressure sensor chips have special environmental requirements, so the current aging device for MEMS pressure sensor chips is still blank. Contents of the invention [0003] Aiming at the problem that the aging device of the existing MEMS pressure sensor chip is still blank, the purpose of the present invention is to provide a MEMS pressure sensor chi...

Claims

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Application Information

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IPC IPC(8): B81B5/00G01L7/00H01L21/66
Inventor 张威刘勐黄海
Owner 北京青鸟元芯微系统科技有限责任公司