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Coating composition of positive type photosensitive polyimide

A technology of polyimide and composition, which is applied in the field of polyimide coating composition, and can solve problems such as low film thickness retention rate and complicated synthesis steps

Active Publication Date: 2005-11-23
IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In US6524764 Examples 6-13, it is pointed out that when polyamic acid ester is converted into polyimide, it will cause shrinkage (shrinkage), so the film thickness retention rate of PSPI composed of polyamic acid ester is also low (66%) , and its synthetic steps are more complex

Method used

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  • Coating composition of positive type photosensitive polyimide
  • Coating composition of positive type photosensitive polyimide
  • Coating composition of positive type photosensitive polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] Using a 1000 ml three-neck round bottom flask equipped with a mechanical stirrer and nitrogen inlet, add 18.3 g (50 mmol) of Bis-APAF, 12.3 g (30 mmol) of BAPP, 2.02 g (10 mmol) of ODA, 20.5 grams (50 millimoles) of TMEG and 15.5 grams (50 millimoles) of ODPA, and added 400 grams of NMP solvent. After the above solution was stirred at 0° C. for 4 hours, 2.18 grams (20 mmol) of end-capping agent 3-aminophenol (3-aminophenol) was added, and stirred at room temperature for another 4 hours, and then 80 grams of After xylene, the temperature was raised to 180° C. and stirred for 3 hours. Viscous PI solution PI-1 can be obtained after cooling. Through infrared (IR) spectral analysis, the PI synthesized in this embodiment is at 1781cm -1 and 1377cm -1 It has the characteristic absorption of imide C=O and C-N, such as figure 1 shown. Take 50 grams of PI-1 solution, add 1.875 grams of PIC-3 and 1.875 grams of DML-PC and mix evenly to obtain a photosensitive polyimide coatin...

Embodiment 2

[0085] Using a 1000 ml three-neck round bottom flask equipped with a mechanical stirrer and nitrogen inlet, add 7.6 g (50 mmol) of 3,5-DABA, 12.975 g (30 mmol) of m-BAPS, 1.54 g (7.5 millimoles) of ODA, 32.8 grams (80 millimoles) of TMEG and 6.2 grams (20 millimoles) of ODPA, and added 400 grams of NMP solvent. After the above solution was stirred at 0°C for 4 hours, 2.73 grams (25 mmol) of end-capping agent 3-aminophenanol was added, and stirred at room temperature for another 4 hours, and the temperature was raised to 180 after adding 80 grams of xylene. °C and stirred for 3 hours. Viscous PI solution PI-2 can be obtained after cooling. Take 50 grams of PI-2 solution, add 1.875 grams of PIC-3, 1.0 grams of MTPC and mix evenly to obtain a photosensitive polyimide coating composition PSPI-2. Then, the PSPI-2 coating composition was coated on the ITO glass by the spin coating method, and after a soft-baking procedure at 110° C. for 2 minutes on a heating plate, a film with a ...

Embodiment 3

[0087]Using a 1000 ml three-necked round bottom flask equipped with a mechanical stirrer and nitrogen inlet, add 10.8 g (50 mmol) of HAB, 12.975 g (30 mmol) of m-BAPS, 2.02 g (10 mmol) of ODA and 41.0 g (100 mmol) of TMEG, and 400 g of NMP solvent was added. After the above solution was stirred at 0°C for 4 hours, 2.18 grams (20 mmol) of end-capping agent 3-aminophenanol was added, and stirred at room temperature for another 4 hours, after adding 80 grams of xylene, the temperature was raised to Stir at 180°C for 3 hours. Viscous PI solution PI-3 can be obtained after cooling. Take 50 grams of PI-3 solution, add 1.875 grams of PIC-3 and 2.25 grams of BIPC-PC and mix evenly to obtain a photosensitive polyimide coating composition PSPI-3. The PSPI-3 coating composition was coated on the ITO glass by the spin coating method, and a film with a film thickness of about 1.2 μm was obtained after a 2-minute soft-baking procedure at 110° C. on a heating plate. Then the above-mention...

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PUM

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Abstract

The invention relates to a positive light sensitivity medlin layer material component which comprises organic solvent and its soluble (a) medlin with a phenol or carboxyl on its main chain end, (b) component with a phenol, and (c) chinone nitrogen petroleum sulfonate as sensitizing agent with the element of relatively one hundred units (a), 1í½50 weight units element (b), and 1í½50 weight units element (c). The said positive light sensitivity medlin can be used in alkaline solution and in display's insulation layer.

Description

technical field [0001] The invention relates to a positive photosensitive polyimide coating composition, which can be used to form an insulating layer of a display. Background technique [0002] Polyimide (polyimide, PI) is widely used in the semiconductor and display industries due to its excellent thermal stability and good mechanical, electrical and chemical properties, such as IC chip protection film, chip scale package (chip scale package, CSP) and the insulating layer (insulator) on the display, etc. Since the use of photosensitive polyimide (PSPI) can simplify the manufacturing process, reduce the cost and improve the product yield, the use of PSPI has become a trend. [0003] There are many related documents on positive photosensitive polyimide, but most of them are precursors of polyimide such as polyamic acid ester, such as US 6329110, US 6291619, US 6232032 and US 5858584 and other patents revealed in. The pattern of the polyamic acid es...

Claims

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Application Information

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IPC IPC(8): G03F7/023
Inventor 郑志龙金进兴吕常兴
Owner IND TECH RES INST