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Overcurrent preventing assembly and production thereof

A manufacturing method and overcurrent technology, which can be applied to resistors with positive temperature coefficients and other directions, can solve problems such as damage, unsuitability for electronic devices, and wrinkling of the PTC material layer 12, and achieve the effect of reducing residual stress.

Inactive Publication Date: 2005-12-28
POLYTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the existing overcurrent protection components adopt high thermal compression bonding, it is easy to form wrinkles or even damage on the surface of the PTC material layer 12
At present, the practical way to avoid the above-mentioned problems is to use thicker PTC material layer 12 and electrode foil 11, but this will make the thickness of the overcurrent protection component 10 reach more than 100 microns (μm), which is not suitable for increasingly miniaturized applications. electronic device

Method used

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  • Overcurrent preventing assembly and production thereof
  • Overcurrent preventing assembly and production thereof
  • Overcurrent preventing assembly and production thereof

Examples

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Embodiment Construction

[0016] Figure 2(a) to 2(c) The manufacturing method of the overcurrent protection component of the present invention is exemplified. Please refer to Figure 2(a) and 2(b) 1. On the surface of a PTC material layer 21, a conductive layer 22 embedded in the surface of the PTC material layer 21 is formed by plasma spraying, sputtering, etc., for conducting electricity during subsequent electrodeposition. The surface of the PTC material layer 21 can be roughened by plasma ion bombardment, and the conductive layer 22 then covers the surface of the PTC material layer 21 . The material of the conductive layer 22 can be selected from silver, nickel, aluminum, titanium, nickel-chromium alloy, etc., and its thickness is between 50 angstroms and 5000 angstroms. By adjusting the intensity and time of the plasma, the roughness of the interface can be elastically adjusted, and the thickness of the conductive layer 22 can be controlled by adjusting the sputtering process parameters. In o...

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Abstract

The overcurrent protection module consists of two electrode layers, a PTC material layer, and at least one conducting layer. It has a laminated construction in and out which the PTC material and two electrode layers are set. At least one conducting layer is embedded into the surface of PTC material layer, and is stacked between PTC material layer and at least one electrode layer for conduction and connection. The conduction layer is embedded into PTC material layer by using plasma spraying or sputtering for usage of conduction at time of forming electrode layer by using plate or other anode coagulant dip process method in next step.

Description

technical field [0001] The present invention relates to an overcurrent protection component and a manufacturing method thereof, in particular to an overcurrent protection component with a positive temperature coefficient (Positive Temperature Coefficient; PTC) characteristic and a manufacturing method thereof. Background technique [0002] The resistance value of existing PTC components responds quite sensitively to temperature changes. When the PTC component is in normal use, its resistance can maintain a very low value so that the circuit can operate normally. However, when the temperature rises to a critical temperature due to over-current or over-high temperature, its resistance value will instantly jump to a high resistance state (for example, above 104ohm) and reverse the excess current to protect the battery. or circuit assembly purposes. Since the PTC component can effectively protect electronic products, the PTC component has been integrated into various circuit c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/02
Inventor 马云晋林承贤蔡东成
Owner POLYTRONICS TECH