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BGA package and manufacturing method

A technology for packaging substrates and bonding pads, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., and can solve problems such as unreliable BGA packaging and poor interface characteristics

Inactive Publication Date: 2006-01-11
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] As a result, the BGA package becomes unreliable, exhibiting the formation of non-wetted areas on the solder side and poor interface properties
For example, as shown in FIG. 6, the solder 600 is not bonded to the plating layer 170 or is easily separated at the time of external impact.

Method used

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  • BGA package and manufacturing method
  • BGA package and manufacturing method
  • BGA package and manufacturing method

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Embodiment Construction

[0043] Reference will now be made to the drawings, wherein like reference numerals are used to designate like or similar parts throughout the different views.

[0044] will refer to Figure 7 and 8 to describe the method of manufacturing a BGA package according to the present invention. Figure 7 is a flowchart illustrating a manufacturing process for a BGA package, and FIG. 8 provides a cross-sectional view illustrating the manufacturing of a BGA package through process steps.

[0045] First, a BGA package substrate provided with bonding pads 170 is prepared (S100).

[0046] More specifically, a CCL (Copper Clad Laminate) used as the BGA package substrate substrate 100 is processed at predetermined positions to form via holes 130 having interconnections to circuits on the substrate, such as Figure 8a with 8b shown.

[0047] The CCL is made of reinforcement 110 and copper foil 120 . The reinforcement 110 is glass fiber impregnated with epoxy resin. The CCLs are based on B...

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Abstract

In the ball grid array (BGA) package and its manufacturing method, an open region of a bonding pad is etched to a depth reaching below the solder mask to give an etched portion which is planar at the bottom center and slanted at the periphery. With this structure of the etched portion, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability, showing excellent interfacial properties and drop test results.

Description

technical field [0001] The present invention relates to BGA packages and methods of manufacturing the same. In particular, the present invention relates to a BGA package having superior reliability, exhibiting excellent interface characteristics and drop test results. In addition, the present invention relates to a method of manufacturing a BGA package wherein the bond pads are etched to a depth reaching below the solder mask to provide an etched portion that is flat at the bottom center and sloped at the periphery to provide increased bonding to the solder area. Background technique [0002] Although integrated circuits have been developed for thinness, the number of wires protruding from integrated circuit packages is increasing rather than decreasing. As a solution to the problems caused by small package carriers requiring a large number of wires, PGA (Pin Grid Array) carriers have been developed. Although it can provide many wires to its small area, the PGA carrier ha...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/60H01K3/00H01L21/58H01L21/56
CPCH01L2924/01327H01L2924/15311H01L2924/01046H01L2924/01029H01L2924/01078H01L2924/01079H01L2224/73265H01L2924/014H01L2924/01077H01L2224/48227H01L2224/32225H01L24/73H01L2924/14H01L2924/00012H01L2924/00H01L23/48H01L23/52
Inventor 李孝洙李胎坤朴成垠
Owner SAMSUNG ELECTRO MECHANICS CO LTD