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Poly(phenylene ether) resin composition, prepreg, and laminated sheet

A technology of polyphenylene ether resin and prepreg, which is applied in the field of laminates and can solve problems such as difficulty in production, decreased heat resistance of laminates, and reduced relative content

Active Publication Date: 2006-03-08
MATSUSHITA ELECTRIC WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, the reduction in the molecular weight of PPE is accompanied by the problem of a decrease in the heat resistance of the resulting laminate
Although the decrease in heat resistance can be prevented by increasing the amount of cross-linking curing agent and triallyl isocyanurate, but at the same time it will cause a decrease in the relative content of PPE with excellent dielectric properties, making it difficult to produce higher Products with low dielectric constant

Method used

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  • Poly(phenylene ether) resin composition, prepreg, and laminated sheet
  • Poly(phenylene ether) resin composition, prepreg, and laminated sheet
  • Poly(phenylene ether) resin composition, prepreg, and laminated sheet

Examples

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preparation example Construction

[0069] Preparation of Low Molecular Weight PPE (PPE-1)

[0070] First, adjust the molecular weight of PPE.

[0071]Prepare and mix 36 parts by mass of PPE (Japan GE Plastics Co., Ltd., trade name "Noryl PX9701", number average molecular weight 14,000), 1.54 parts by mass of 2,6-xylenol as phenols, 1.06 parts by mass of tert-butylperoxyisopropyl monocarbonate (NOF Corporation, trade name "Perbutyl I"), and 0.0015 parts by mass of cobalt naphthenate. To this mixture was added 90 parts by mass of toluene as a solvent, and the mixture obtained above was stirred at 80°C for 1 hour to disperse or dissolve the components. After the reaction was completed, the prepared PPE was reprecipitated by adding a large amount of methanol, and after removing impurities, it was dried at 80° C. under reduced pressure for 3 hours to completely remove the solvent. The number average molecular weight of the PPE obtained after this step was determined to be about 2,400 by gel permeation chromatograp...

Embodiment 1

[0085] 70 parts by mass of vinylbenzene methylated low molecular weight PPE ("PPE-1") and 100 parts by mass of toluene as a solvent were mixed and stirred at 80°C for 30 minutes until completely dissolved. In the PPE solution obtained, add 30 mass parts of TAIC (Japan Chemical Industry Co., Ltd.) as a crosslinking curing agent, 20 mass parts of brominated organic compound decabromodiphenylethane (Albemarle Asano company, trade name " SAYTEX 8010 ", bromine content: 82wt%) as a flame retardant, and 2.5 parts by mass of α, α'-bis(tert-butylperoxym-isopropyl)benzene (NOF Corporation, trade name "Perbutyl P") ) as an initiator. Further, 14 parts by mass of spherical silica (Denki Kagaku Kogyo Co., Ltd., trade name "FB3SDC") was added as an inorganic filler, and then the above mixture was mixed, dispersed and dissolved in a solvent (toluene) to obtain a resin composition, namely varnish. Since the flame retardant is a brominated organic compound that does not react with PPE and T...

Embodiment 2～9

[0092] Using the components in the compositions shown in Table 1 and Table 2, prepregs and samples (i) to (v) were prepared in a similar manner to Example 1. Incidentally, the unmodified PPE with a number average molecular weight of about 9,000 added in Example 9 was obtained from the above-mentioned PPE with a number average molecular weight of 14,000 (Japan GE Plastics Co., Ltd., trade name "Noryl PX9701") by molecular cutting technology. prepared.

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Abstract

It is an object of the present invention to provide a polyphenylene ether resin composition for producing laminates with excellent heat resistance and processability, which does not cause damage even when low-molecular weight PPE is used to simplify the production of prepregs. Sacrifice dielectric properties. The polyphenylene ether resin composition according to the present invention contains polyphenylene ether and a crosslinking curing agent, wherein the polyphenylene ether is represented by the following formula (I), and its number average molecular weight is in the range of 1,000 to 7,000. [wherein, X is aryl; (Y) m Is a polyphenylene ether part; Z is a phenylene group, etc.; R 1 to R 3 each independently is a hydrogen atom or the like; n is an integer of 1 to 6; q is an integer of 1 to 4].

Description

technical field [0001] The present invention relates to a heat-resistant polyphenylene ether (hereinafter referred to as PPE) resin composition suitable for use as an insulating material for printed wiring boards, a prepreg using the PPE resin composition, and a laminate using the prepreg. Background technique [0002] In recent years, with the development of integration technology, bonding technology and assembly technology of semiconductor devices used in electronic equipment, high-density electronic instrument components and high-density printed circuit board wiring, electronic equipment has been continuously improved, especially in those There have been amazing developments in electronic devices such as mobile communication devices using broadband. [0003] Printed wiring boards, which are one component of such electronic equipment, are progressing toward higher degrees of multilayer printed boards with finer-pitch wiring. In order to i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L71/00
Inventor 井上博晴齐藤英一郎藤原弘明
Owner MATSUSHITA ELECTRIC WORKS LTD
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