Laminated structure of printing circuit board and multi-laminate laminated structure

A printed circuit board, laminated structure technology, applied in the directions of printed circuit, multilayer circuit manufacturing, electrical components, etc., can solve the problems of increasing the area of ​​the current loop, increasing the space radiation interference, and increasing the signal current loop. , to achieve the effect of improving high frequency performance

Inactive Publication Date: 2006-03-15
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to this division, if the adjacent signal layer has a signal line that crosses the division, such as image 3 As shown, the return flow on the power layer cannot pass through this division slot, but can only bypass; after bypassing, the entire signal current loop is significantly increased, as shown in image 3 As shown, when the signal AB is reflowed on the power plane, due to the existence of the groove, the circuit reflowed on the power plane has to flow along the groove. For the signal CD, the circuit returned on the power plane also has to flow along the groove, which bring

Method used

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  • Laminated structure of printing circuit board and multi-laminate laminated structure
  • Laminated structure of printing circuit board and multi-laminate laminated structure
  • Laminated structure of printing circuit board and multi-laminate laminated structure

Examples

Experimental program
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Effect test

Embodiment 1

[0042] according to Figure 4 , a stacked structure of a twelve-layer printed circuit board is as follows: the sixth layer and the seventh layer are the power supply layer; the second layer, the fifth layer, the eighth layer, and the eleventh layer are the ground plane layer; the first layer The first, third, fourth, ninth, tenth, and twelfth layers are signal layers.

[0043] Depend on Figure 4 As shown, the fifth layer to the eighth layer are the ground plane layer G5, the power layer P6, the power layer P7, and the ground plane layer G8 in sequence. The power layer P6 and the power layer P7 are located in the middle stacking position of the printed circuit board. The stacked structure on the upper and lower sides of the power supply layers P6 and P7 is symmetrical, that is, the arrangement sequence from top to bottom is exactly the same as that from bottom to top, and the stacked structure is based on the power supply layers P6 and P7 as the axis of symmetry.

[0044] Th...

Embodiment 2

[0053] Such as Figure 5 A fourteen-layer printed circuit board is shown, and its laminated structure is: the seventh layer and the eighth layer are power supply layers; the second layer, the fourth layer, the sixth layer, the ninth layer, the eleventh layer, The thirteenth layer is the ground plane layer; the first, third, fifth, tenth, twelfth, and fourteenth layers are signal layers.

[0054] Depend on Figure 5 As shown, the sixth to ninth layers are the stacking sequence of the ground plane layer G6, the power layer P7, the power layer P8, and the ground plane layer G9, and the power layer P7 and the power layer P8 are located in the middle of the printed circuit board The stacking position, the upper and lower sides of the power layer P7 and P8 are symmetrical to the stacked structure, that is, the arrangement order from top to bottom is exactly the same as that from bottom to top, and the power layer P7 and P8 are the symmetry axes In the stacked structure, the signal...

Embodiment 3

[0066] according to Figure 6 , a sixteen-layer printed circuit board laminated structure is: the eighth layer, the ninth layer is the power layer; the second layer, the fifth layer, the seventh layer, the tenth layer, the twelfth layer, the fifteenth layer The first layer, the third layer, the fourth layer, the sixth layer, the eleventh layer, the thirteenth layer, the fourteenth layer, and the sixteenth layer are signal layers.

[0067] Depend on Figure 6 As shown, layers 7 to 10 include a stacking sequence of ground plane layer G7, power layer P8, power layer P9, and ground plane layer G10. Power layer P8 and power layer P9 are located in the middle of the printed circuit board The stacking position, the stacking structure of the upper and lower sides of the power supply layers P8 and P9 is symmetrical, that is, the arrangement order from top to bottom is exactly the same as that from bottom to top, and the stacking is based on the power supply layers P8 and P9 as the axi...

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PUM

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Abstract

A laminated structure for PCB is composed of ground layer, power supply layer, power supply layer and ground layer. Said two power supply layers between two grounding layers are positioned symmetrically at central position of whole PCB. A 12-layer PCB is composed of the 6th and the 7th power supply layers, the second, the 5th, the 8th and 11th ground layer, and the first, the third, the 4th, the 9th, the 10th and the 12th signal layers. The 14-layer and 16-layer PCBs are also disclosed.

Description

technical field [0001] The invention relates to a laminated structure layer of a printed circuit board and a corresponding laminated structure of twelve, fourteen and sixteen-layer printed circuit boards. Background technique [0002] With the rapid development of science and technology, the integration and complexity of chips are getting higher and higher. The design of printed circuit board PCB has the following characteristics: [0003] (1) The signal rate transmitted on the PCB is getting higher and higher, from the original several MHZ to dozens of MHZ, and even to the current several GHZ. [0004] (2) The types of the power supply on the PCB have also changed from the original few to more than ten kinds now, the voltage level on the PCB is getting lower and lower, and the power supply power is getting higher and higher. [0005] (3) The signal interconnection density on the PCB is also increasing. [0006] This puts forward higher requirements on the signal integrity...

Claims

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Application Information

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IPC IPC(8): H05K1/00H05K3/46B32B33/00
Inventor 刘卫东胡庆虎赵经能贾荣华黄希斌唐晟唐艳梅何波刘涛余进姜向中
Owner HUAWEI TECH CO LTD
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