Laminated structure of printing circuit board and multi-laminate laminated structure

A printed circuit board, laminated structure technology, applied in the directions of printed circuit, multilayer circuit manufacturing, electrical components, etc., can solve the problems of increasing the area of ​​the current loop, increasing the space radiation interference, and increasing the signal current loop. , to achieve the effect of improving high frequency performance
CN1747620AInactive Publication Date: 2006-03-15HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HUAWEI TECH CO LTD
Publication Date
2006-03-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

A laminated structure for PCB is composed of ground layer, power supply layer, power supply layer and ground layer. Said two power supply layers between two grounding layers are positioned symmetrically at central position of whole PCB. A 12-layer PCB is composed of the 6th and the 7th power supply layers, the second, the 5th, the 8th and 11th ground layer, and the first, the third, the 4th, the 9th, the 10th and the 12th signal layers. The 14-layer and 16-layer PCBs are also disclosed.
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Description

technical field

[0001] The invention relates to a laminated structure layer of a printed circuit board and a corresponding laminated structure of twelve, fourteen and sixteen-layer printed circuit boards. Background technique

[0002] With the rapid development of science and technology, the integration and complexity of chips are getting higher and higher. The design of printed circuit board PCB has the following characteristics:

[0003] (1) The signal rate transmitted on the PCB is getting higher and higher, from the original several MHZ to dozens of MHZ, and even to the current several GHZ.

[0004] (2) The types of the power supply on the PCB have also changed from the original few to more than ten kinds now, the voltage level on the PCB is getting lower and lower, and the power supply power is getting higher and higher.

[0005] (3) The signal interconnection density on the PCB is also increasing.

[0006] This puts forward higher requirements on the signal integrity...

Claims

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