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Substrate processing device and method

A substrate processing device and substrate technology, applied in the field of processing liquid, can solve problems such as hindering the adjustment of slit nozzles, and achieve the effect of suppressing uneven coating

Active Publication Date: 2006-04-12
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, on the outer peripheral surface of the roller, some residues that cannot be removed by the scraper are produced, and these residues will hinder the adjustment of the slit nozzle to the specified state

Method used

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  • Substrate processing device and method
  • Substrate processing device and method
  • Substrate processing device and method

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no. 1 approach

[0054]

[0055] FIG. 1 is a perspective view schematically showing a slit coater 1 which is a substrate processing apparatus according to a first embodiment of the present invention. In addition, in FIG. 1 , for the convenience of illustration and description, the Z-axis direction is defined to represent the vertical direction, and the XY plane is defined to represent the horizontal plane. The same applies to the following figures.

[0056] The slit coater 1 can be roughly divided into a coating processing section 2 and a control section 8, and a square glass substrate used for manufacturing a screen panel of a liquid crystal display device is used as a substrate to be processed (hereinafter simply referred to as "substrate") 90 , the slit coater 1 is a coating treatment device for coating a resist solution as a treatment liquid on the surface of the substrate 90 during the process of selectively etching the electrode layer formed on the surface of the substrate 90, etc. . ...

no. 2 approach

[0121]

[0122] FIG. 6 is a perspective view showing a schematic configuration of a slit coater 210 which is a substrate processing apparatus according to a second embodiment of the present invention. The slit coater 210 is a coating processing device that performs a coating process called slit coating in which a resist solution as a processing liquid is applied to the surface of the substrate 290, and is used for selective etching. The process of the electrode layer formed on the surface of the substrate 290, etc. The substrate 290 to be coated by the slit coater 210 is typically a square glass substrate used for manufacturing a screen panel of a liquid crystal display device, and may also be a semiconductor substrate, a flexible substrate for thin-film liquid crystal, or a photomask. Substrates, substrates for color filters, and other substrates.

[0123] As shown in FIG. 6 , the slit coater 210 is roughly divided into a control unit 201 for controlling the entire apparat...

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Abstract

The present invention provides a substrate dealing apparatus and its method to inhibit application unevenness by optimizing the state of a slit nozzle. In a slit nozzle 41, the first lip side 410a of a first lip 410 is arranged in the position where only a level difference D is lower than the second lip side 411a of a second lip 411. Preliminary application processing is performed by applying resist liquid to a roller 71 of a spare applying member while making the slit nozzle 41 scan in the direction ((-X) direction) opposite to the scanning direction ((+X) direction) of the slit nozzle 41 in this application processing. The application processing is performed by applying the resist liquid to a substrate 90 while making the slit nozzle 41 scan in the direction (+X) which is normalized by the preliminary application processing.

Description

technical field [0001] The present invention relates to a method for applying photoresist to the surface of substrates such as glass square substrates for liquid crystals, semiconductor wafers, flexible substrates for thin-film liquid crystals, photomask substrates, and color filter substrates (hereinafter simply referred to as "substrates"). Etchant and other processing liquid technology. More specifically, it relates to a technique of normalizing the state of the nozzle to improve coating accuracy. Background technique [0002] Conventionally, there is known a substrate processing apparatus that applies a processing liquid such as a photoresist to the surface of a substrate. As such a substrate processing apparatus, there is known a slit coater that performs coating treatment (slit coating) for forming a coating layer using a slit nozzle having a slit-shaped discharge portion. In a slit coater that does not perform a spin process to make the coating thickness uniform aft...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/02B05B3/18B05B1/02
Inventor 高木善则冈田广司川口靖弘
Owner DAINIPPON SCREEN MTG CO LTD
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