Substrate processing apparatus, pressure control method for substrate processing apparatus
A substrate processing device and pressure control technology, which are used in semiconductor/solid-state device manufacturing, ion implantation plating, gaseous chemical plating, etc., can solve the problem of a narrow range of pressure control, no description of the process chamber supplying pressure regulating gas, being Handles issues such as substrate handling effects to reduce manufacturing costs
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[0026] The best embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In this specification and the drawings, the same symbols are assigned to components having substantially the same functional structure, and repeated descriptions are omitted.
[0027] (Structure of Substrate Processing Equipment)
[0028] First, the configuration of a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. figure 1 It is a figure which shows the schematic structure of the substrate processing apparatus concerning this embodiment. The substrate processing apparatus 100 includes a processing chamber 102 for processing a substrate to be processed, such as a semiconductor wafer (hereinafter simply referred to as “wafer”) W, using a processing gas. The processing chamber 102 is constituted by, for example, a conductive airtight processing container, and is g...
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