Shielding method for infrared remote control receiving amplifier and infrared remote control receiving amplifying device thereof

Abstract

The invention discloses an infrared remote receiving amplifier and method for shielding the amplifier. The apparatus comprises: photosensitive receiving chip, semi-conductor amplifying integrated circuit chip, and mount, metal wire screened and encapsulation body, wherein the metal wire screened is screened on two chips and being stuck with mount, the metal wire screened has a first grid area of low density. By employing the structure, the metal wire screened receives infrared signal with the first grid area and realizes screen with grids. The invention has the advantages of having good screening effect and extending receiving distance of receiving device.

Description

technical field [0001] The invention relates to a combination of an integrated circuit and a photoelectric component in the electronics industry, in particular to a shielding method for an infrared remote control receiving amplifier and an infrared remote control receiving amplifier. Background technique [0002] Infrared remote control technology is a technology that uses infrared rays for point-to-point communication. Infrared rays are outside visible light in the spectrum, so they have strong anti-interference and have the characteristics of straight-line propagation of light waves, which are not easy to cause mutual interference. It is a good information transmission medium . The use of infrared remote control technology has the characteristics of no signal interference, high transmission accuracy, small size, low power, and low cost. Therefore, it is widely used in various electronic fields, especially in the field of home appliances such as color TVs, DVDs, air conditi...

AI Technical Summary

Problems solved by technology

However, on the one hand, due to the poor anti-interference ability of semiconductor amplifier integrated circuits; Electromagnetic interference; if the two chips of the photosensitive receiver and the preamplifier are directly packaged, the semiconductor amplifying integrated circuit will be easily affected by electromagnetic interference and affect the stability and reliability of the work. Therefore, the semiconductor amplifying integrated circuit chip is Shielding is key to integrating photosensitive receivers with preamplifiers

To solve this problem, see figure 1 As shown, what the prior patent of Germany adopts is that the support plate body 21' is integrally extended to form a sheet body 33', and then the sheet body 33' is turned over to form a cover cover on the photosensitive receiver chip 11' and On semiconductor amplifying integrated circuit chip 12 ', thus form the shielding to semiconductor amplifying integrated circuit, wherein hollow out 301 ' in the middle part of sheet body 33 ' and make photosensitive receiver be easy to receive, because stopper 33 ' and fix two chips 11 ', 12 The boards 21' of ' are all empty, which makes the shielding effect poor, and because the flipping of the sheet 33' requires mechanical stress, it is easy to cause damage to the gold wire of the integrated circuit; see figure 2 Shown, and Japan's prior patent is to make a cover 3' with iron shell, hollow out 301' at the photosensitive receiving place equally, then cover 3 ' point riveted on fixed photosensitive receiver chip 11 ' and On the plate body 21' of the semiconductor amplifying integrated circuit chip 12', although the shielding effect is improved compared to the German patent, it is still insufficient, and the installation is extremely troublesome, requiring special equipment, resulting in large mechanical stress and potential damage. At the same time, due to the high cost, its cost performance is poor, and the volume is also large, which is not conducive to the miniaturization of electronic components

Images