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Flexible wiring substrate, method for producing it, semiconductor device and electronic device

A technology for flexible wiring substrates and manufacturing methods, applied in semiconductor devices, semiconductor/solid-state device parts, printed circuit manufacturing, etc., can solve problems such as difficult to achieve fine pitch, prevent graphic disconnection or peeling, and improve mechanical strength Effect

Active Publication Date: 2006-06-07
SHENZHEN TOREY MICROELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while COF can be freely bent, it is necessary to increase the mechanical strength accompanying the thinning of the wiring pattern. As mentioned above, there is a problem that it is difficult to achieve fine pitch in the conventional technology.

Method used

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  • Flexible wiring substrate, method for producing it, semiconductor device and electronic device
  • Flexible wiring substrate, method for producing it, semiconductor device and electronic device
  • Flexible wiring substrate, method for producing it, semiconductor device and electronic device

Examples

Experimental program
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Effect test

Embodiment approach 1

[0065] if according to Figure 1 to Figure 4(d) The first embodiment of the present invention will be described as follows. figure 1 is a cross-sectional view showing a schematic configuration of the semiconductor device according to the present embodiment. also, figure 2 is for showing figure 1 A cross-sectional view of a schematic structure of a semiconductor device when the line A-A' shown in is cut.

[0066] like figure 1 and figure 2 As shown in , a semiconductor device 1 includes a semiconductor element (electronic component) 2 and a tape carrier (flexible wiring board) 3 . The semiconductor element 2 is connected to the tape carrier 3 and is mounted on the tape carrier 3 . In addition, an insulating resin 4 is sealed in a gap existing between the tape carrier 3 and the semiconductor element 2 . Thus, in this embodiment, a COF type semiconductor device in which the semiconductor element 2 is mounted on the tape carrier 3 will be described as an example.

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Embodiment approach 2

[0094] if according to Figure 1 to Figure 3 The second embodiment of the present invention is described with FIG. 5( d ), and it is as follows. figure 1 is a cross-sectional view showing a schematic configuration of the semiconductor device according to the present embodiment. also, figure 2 is for showing figure 1 A cross-sectional view of a schematic structure of a semiconductor device when the line A-A' shown in is cut.

[0095] like figure 1 As shown in , a semiconductor device 1 includes a semiconductor element 2 and a tape carrier 3 . In the present embodiment, compared with the first embodiment described above, the manufacturing method of the semiconductor device 1 is different, but the structure of the semiconductor device 1 is the same. Therefore, the same reference numerals are attached to the members already described in Embodiment 1, and description thereof will be omitted. In addition, in this embodiment mode, the manufacturing method of the semiconduct...

Embodiment approach 3

[0107] if according to Figure 6 to Figure 9(d) A description of a third embodiment of the present invention will be as follows. Image 6 is a cross-sectional view showing a schematic configuration of the semiconductor device according to the present embodiment. also, Figure 7 is for showing Image 6 A cross-sectional view of a schematic structure of a semiconductor device when the line B-B' shown in is cut.

[0108] like Image 6 and Figure 7 As shown in , a semiconductor device 21 includes a semiconductor element 2 and a tape carrier (flexible wiring board) 23 . The semiconductor element 2 is connected to the tape carrier 23 and is mounted on the tape carrier 23 . In addition, the insulating resin 4 is sealed in the gap existing between the tape carrier 23 and the semiconductor element 2 . In this way, also in this embodiment, a COF-type semiconductor device in which the semiconductor element 2 is mounted on the tape carrier 23 will be described as an example. In a...

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Abstract

PROBLEM TO BE SOLVED: To provide a flexible wiring board which can make a wiring pattern shape after etching more excellent than that of the conventional tape carrier for a COF semiconductor device, can make a connection state between the wiring pattern and a semiconductor element satisfactory, and can make the mechanical strength of the wiring pattern of an nonconnected part more improved than in the conventional types, and to provide a semiconductor device and electronic equipment that use the wiring board. SOLUTION: A flexible wiring board is provided with an insulating tape 6 and a wiring pattern 57, formed on the insulating tape 6. The wiring pattern 57 is formed into a predetermined pattern and has a connecting part for connecting a semiconductor element 2 thereto, in a mounting region which the semiconductor element 2 is connected to and mounted on. Only the thickness of the wiring pattern 57 in the connection part is made thinner than that of a wiring layer in the nonconnected part. COPYRIGHT: (C)2008,JPO&INPIT

Description

technical field [0001] The present invention relates to a flexible wiring board, a semiconductor device and electronic equipment using the same, and a method for manufacturing the flexible wiring board. More specifically, it relates to a flexible wiring board on which a semiconductor element is mounted, a semiconductor device and electronic equipment using the same, and a method for manufacturing the flexible wiring board. Background technique [0002] Examples of semiconductor devices in which semiconductor elements are bonded and mounted on a flexible wiring board include TCP (Tape Carrier Package), COF (Chip on Film), and the like. As differences between these TCPs and COFs, the following points can be mentioned, for example. [0003] First, in the TCP, an opening for mounting a semiconductor element is provided in advance in an insulating tape, a wiring pattern is formed in a cantilever-like protruding state, and the tip portion of the wiring pattern...

Claims

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Application Information

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IPC IPC(8): H05K1/18H01L23/488H05K1/02H05K3/00
CPCH01L2224/73204
Inventor 濑古敏春
Owner SHENZHEN TOREY MICROELECTRONIC TECH CO LTD