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Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same

A technology for electrical connection and test fixtures, which is applied in the direction of welding/welding connection, connection, electrical components, etc., and can solve problems such as expensive manufacturing costs

Inactive Publication Date: 2006-07-19
吴景淞 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Forming intersecting V-shaped grooves on the base material is different from the design of forming a protruding conductive structure by electroplating on a general circuit board. Innovative manufacturing equipment must be used, which will have more expensive manufacturing cost

Method used

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  • Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same
  • Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same
  • Non-alloy fusion spliced electrical connection construction and test metallurgical appliance utilizing the same

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Embodiment Construction

[0042] For other purposes, functions and embodiments of the present invention, please refer to the accompanying drawings for detailed description as follows.

[0043] see Figure 4 , 5 shown. The electrical connection structure of the first embodiment of the present invention includes a substrate 50, such as a printed circuit board, having an array of contact units 51 protruding upward. Each contact unit 51 corresponds to each solder ball 601 on the surface of the IC chip 60 . Each contact unit 51 can be in contact with each solder ball 601 to be electrically connected; Figure 5 shown.

[0044] In this embodiment, a fixing unit 70 is combined above the substrate 50 , and the fixing unit 70 has a frame seat 71 . The inner side of the frame seat 71 covers the periphery of the array of contact units 51 and is used for accommodating and fixing the IC chip 60 . The frame seat 71 is pivotally connected to a cover body 72 , and the inner side of the cover body 72 is combined w...

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PUM

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Abstract

The invention relates to an electric connection structure and detecting device. The electric connection structure is made by plating the first metallic layer on the metallic foil of circuit board to form dual protrude pattern to form the touch unit array; and if arranging a detecting circuit on the circuit board, it can be used as detecting device. The invention can directly form the electric connection structure on the circuit board to reduce the distance of IC chip electric connection circuit board, and meet the demand of high density, high frequency and high-speed signal transmission, with easy production and long service life.

Description

technical field [0001] The present invention relates to an electrical connection structure and a test fixture, in particular to a non-alloy welded electrical connection structure and a test fixture using the structure. Background technique [0002] At present, some integrated circuits (ICs) have a plurality of electrical connection terminals arranged in an array of solder balls; each solder ball is an electrical contact. IC placed in the air, the surface of the solder ball will be oxidized to form an oxide layer on the surface. Therefore, the general IC socket must have a structure that cuts through the oxide layer, so as to be in close electrical contact with the solder balls of the IC and obtain a better electrical conduction effect. [0003] Taiwan Patent Announcement No. 539128 discloses a kind of integrated circuit (IC) test socket with elastic probes, including a socket body 10 and a plurality of elastic probes 20, such as figure 1 shown. The elastic probes 20 are a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R4/02H01R43/02
Inventor 吴景淞杨朝雨
Owner 吴景淞