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Lithographic apparatus, radiation system and filter system

A radiation system and lithography technology, which can be used in photolithography exposure devices, microlithography exposure equipment, optics, etc., and can solve problems such as thermal expansion of metal sheets and support structures.

Inactive Publication Date: 2010-05-26
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to thermal expansion of the sheet metal and supporting structures

Method used

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  • Lithographic apparatus, radiation system and filter system
  • Lithographic apparatus, radiation system and filter system
  • Lithographic apparatus, radiation system and filter system

Examples

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Embodiment Construction

[0028] figure 1 A lithography apparatus according to an embodiment of the present invention is schematically shown. The unit includes:

[0029] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation, EUV radiation or X-rays);

[0030] - a support structure (eg mask table) MT configured to support the patterning device (eg mask) MA and connected to a first positioner PM configured to precisely position the patterning device according to certain parameters;

[0031] - a substrate table (e.g. a wafer table) WT configured to receive a substrate (e.g. a wafer coated with resist) W and connected to a second positioner PW configured to precisely position the substrate according to certain parameters;

[0032] - A projection system (eg a refractive projection lens system) PS configured to project a pattern assigned to the radiation beam B onto a target portion C of the substrate W (eg comprising one or more dies) by means of the pattern...

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Abstract

A lithographic apparatus comprises: a radiation system configured to form a projection beam of radiation; a filter system which is arranged to filter, in use, debris particles out of a predetermined cross-section of the radiation as emitted by the radiation source, wherein the filter system comprises at least a first set of foils and a second set of foils for trapping the debris particles; and a projection system configured to project the projection beam of radiation onto a substrate. The filter system further comprises at least a first heat sink and a second heat sink, wherein each foil of the first set of foils is thermally connected to the first heat sink, and each foil of the second set of foils is thermally connected to the second heat sink, so that, in use, through each foil of the first set of foils heat is conducted towards substantially the first heat sink, and through each foil of the second set of foils heat is conducted towards substantially the second heat sink. The firstset of foils extends substantially in a first section of the predetermined cross-section and the second set of foils extends substantially in a second section of the predetermined cross-section, the first section and the second section being substantially non-overlapping.

Description

technical field [0001] The invention relates to a lithographic apparatus, a radiation system and a filter system. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, photolithographic apparatus may be utilized in the manufacture of integrated circuits (ICs). In this case, a patterning device, also referred to as a mask or reticle, may be employed to create the circuit pattern to be formed on a particular layer of the IC. This pattern can be transferred to a target portion (eg a portion comprising one or several dies) of a substrate (eg a silicon wafer). The transfer of the pattern is typically imaged on a layer of radiation-sensitive material (resist) disposed on the substrate. Typically, a single substrate will contain a network of successively patterned adjacent target portions. A known lithographic apparatus comprises a so-called stepper, in which eac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027
CPCG03F7/70916G03F7/70858H05G2/001
Inventor A·C·瓦辛克
Owner ASML NETHERLANDS BV
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