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Crosstalk canceling pattern for high-speed communications and modular jack having the same

A high-speed communication, anti-crosstalk technology, applied in high-frequency structural connections, parts of connecting devices, coupling devices, etc., can solve the problems of pollution anti-crosstalk patterns, unstable contacts, poor contact, etc.

Inactive Publication Date: 2006-07-26
DAE EUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, in order to prevent surface oxidation caused by high temperature during soldering (5), the flux used may contaminate the anti-crosstalk pattern on the printed circuit board, making the contact unstable and causing poor contact

Method used

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  • Crosstalk canceling pattern for high-speed communications and modular jack having the same
  • Crosstalk canceling pattern for high-speed communications and modular jack having the same
  • Crosstalk canceling pattern for high-speed communications and modular jack having the same

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Embodiment Construction

[0060] The present invention will be described in detail below in conjunction with the embodiments and the accompanying drawings.

[0061] First, Figure 4(a)(b) is an exploded perspective view and an assembly perspective view of an embodiment of the modular socket of the present invention, and Figure 5(a)(b) is a perspective view of an embodiment of a plug and IDC terminal according to the present invention .

[0062] As shown in the figure, the modular socket (100) of the present invention includes a housing (110) that can be inserted into the modular plug (2) and a connecting body that can be assembled and disassembled on the back of the housing (110). The aforementioned connecting body includes a printed circuit board (130) with a plurality of pins (120) and IDC terminals (160) penetratingly combined on its top surface, connected to the aforementioned printed circuit board (130) and can be mounted and disassembled behind the shell (110). A lower connection block (140), and...

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Abstract

The invention relates to a modular socket used for high-speed communication; in particular, a compensation capacitor is arranged on a transmission line to eliminate the interference generated by the parasitic capacitance between adjacent bolts, meanwhile a high-speed communication interference compensation pattern for a second compensation capacitor and a modular socket containing the pattern arealso arranged on the transmission line. The high-speed communication interference compensation pattern and the modular socket containing the pattern include the following units: a casing formed by a bolt buckle positioned at the lower end of a plug faucet and used for fixing the bolt and a combination guiding plate; a multilayer structure type printed circuit board with a plurality of bolts and IDC terminals communicated and combined at the upper part and with a plurality of compensation capacitors; a lower connecting block with the bottom surface combined with the printed circuit board and insliding combination along the combination guiding plate of the casing; and an upper connecting block combined with the upper part of the lower connecting block, cutting a UTP cable leaded from the rear part and connecting the pieces of the UTP cable to the IDC terminals.

Description

technical field [0001] The invention relates to a modular socket for high-speed communication that can transmit 250MHz per pair in UTP 4Pair, especially a kind of first parasitic capacitance that can be eliminated between adjacent plugs when receiving high-frequency signals, and in order to The anti-crosstalk pattern for high-speed communication improves the quality of network use by eliminating the soldering process and adjusting the phase inconsistency that occurs due to the influence of the inductance of the pin and the transmission line, and installing a correction capacitor on the transmission line close to the IDC terminal to meet the performance requirements of Category 6. and modular sockets incorporating this pattern. Background technique [0002] Generally, in order to perform data and voice communication using a terminal such as a computer or a telephone, it is necessary to connect them to a communication line that has entered the interior of a common residence or...

Claims

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Application Information

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IPC IPC(8): H01R13/719H01R13/646H01R24/58H01R13/6464
CPCE02F3/3681E21B3/02
Inventor 金大成金正坤李正锡金修钟
Owner DAE EUN ELECTRONICS
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