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Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus

A device manufacturing method and thin-film patterning technology are applied in conductive pattern formation, semiconductor/solid-state device manufacturing, electric light source, etc. The uniformity improvement and high integration effect of

Inactive Publication Date: 2006-08-09
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to prevent ink from adhering, the surface of the storage dam is subjected to lyophobic treatment, but at this time, the entire storage dam is subjected to lyophobic treatment, so the wettability between the sides of the storage dam and the ink deteriorates, and ink does not go smoothly The problem of ground entering the storage cell cofferdam
In addition, the sides of the storage cell cofferdam repel the ink, so the obtained film also becomes a non-uniform film

Method used

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  • Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
  • Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
  • Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus

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Experimental program
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Embodiment approach 1

[0093] Refer below Figure 4 ~ Figure 7 A method of forming a wiring pattern according to Embodiment 1, which is a method of forming a film pattern of the present invention, will be described. Figure 4 It is a program flow chart showing an example of the method for forming a wiring pattern of this embodiment, Figure 5 ~ Figure 7 It is a schematic diagram showing the formation process.

[0094] Such as Figure 4 As shown, the method for forming a wiring pattern according to this embodiment includes disposing the above-mentioned ink for forming a wiring pattern on a substrate, forming a wiring pattern of a conductive film on the substrate, and generally including: a lyophilic treatment for making the surface of the substrate lyophilic. Step S1; forming steps S2 to S7 of cell banks corresponding to the wiring patterns on the lyophilized substrate; residue treatment step S8 of removing residues between the cells; The material arrangement step S9 of arranging the ink between t...

Embodiment approach 2

[0131] Refer below Figure 4 program flow chart and Figure 8-9 Embodiment 2 of the formation method of the film pattern of this invention is demonstrated. In addition, in the present embodiment, the same reference numerals are assigned to the same members or parts as those in the first embodiment, and detailed description thereof will be omitted.

[0132] In Embodiment 1, photosensitive polysilazane containing polysilazane as the main component and a photoacid generator was used as the storage cell bank material. However, in this embodiment, the storage cell enclosure As the weir material, photosensitive polysiloxane containing polysiloxane and a photoacid generator was used.

[0133] In the manufacturing process, the difference from the first embodiment described above is that no humidification treatment is performed, and the other steps are the same as those of the first embodiment described above. The reason is that when polysilazane is used as the main component of the...

Embodiment approach 3

[0139] Refer below Figure 10 Embodiment 3 of the formation method of the film pattern of this invention is demonstrated. In addition, in this embodiment, the same reference numerals are attached to the same members or parts as those in Embodiments 1 and 2, and detailed description thereof will be omitted.

[0140] The pattern forming method of this embodiment includes: a cell bank forming step of forming a cell bank B on a substrate P; and a material arrangement step of disposing a functional liquid L in a linear region A divided by the cell bank B . The storage cell cofferdam formation process uses the method of Embodiment 1.

[0141] In the pattern forming method of this embodiment, the functional liquid L is placed in the linear region A divided by the cell bank B, and the functional liquid L forms the linear film pattern F on the substrate P by, for example, drying. At this time, since the shape of the film pattern F is defined by the cell bank B, for example, the widt...

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Abstract

The invention provides a method for forming a thin film pattern, in which a film pattern subjected to shrinkage or thinning can be formed accurately and stably. The method for forming a thin film pattern comprises a step for forming a bank B on a substrate P, a step for arranging functional liquid L in a region sectioned by the bank B, and a step for forming a film pattern F by drying the functional liquid L arranged on the substrate P. The bank B is formed, by forming a thin film B0 of a bank-forming material on the substrate P, subjecting the surface to liquid repellent treatment, and then patterning the thin film. Thus, since only the upper surface of the bank B is rendered liquid repellent and the side face of the bank B is not rendered liquid repellent (exhibiting proper wettability to the functional liquid L), the functional liquid L can spread smoothly between the banks, when it is arranged.

Description

technical field [0001] The present invention relates to a film pattern forming method, a device and a manufacturing method thereof, an electro-optical device, and an electronic instrument. Background technique [0002] In the manufacture of devices having wiring of electronic circuits or integrated circuits, for example, photolithography is used. In the photolithography method, a photosensitive material called a resist is coated on a substrate coated with a conductive film in advance, a circuit pattern is irradiated, developed, and the conductive film is etched according to the resist pattern to form a thin-film wiring pattern. This photolithography method requires expensive equipment such as a vacuum device or a complicated process, and the material usage efficiency is only about several percent, and most of it must be discarded, resulting in high manufacturing costs. [0003] In response to this, a so-called inkjet method, which is a droplet discharge method in which a li...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K3/00B41J2/005H01L21/00H01L27/32H05B33/10
Inventor 守屋克之平井利充
Owner SEIKO EPSON CORP