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Horizontal axis micromechanical gyroscope and its preparation method

A technology of micro-mechanical gyroscope and horizontal axis, applied in gyroscope/steering sensing equipment, gyro effect for speed measurement, instrument and other directions, it can solve the problem that it is difficult to realize variable-area sensitive capacitance, capacitance is difficult to detect differentially, and it is difficult to obtain Sensitive capacitance and other issues, to achieve the effect of mass production, reduce processing costs, and improve sensitivity

Inactive Publication Date: 2006-09-06
PEKING UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A three-axis gyro can be realized by assembling three single-axis devices orthogonally, but the error during assembly makes it difficult for the three detection axes to be completely orthogonal, which limits the performance of the three-axis gyro and increases the processing cost.
For the X and Y axis gyroscopes that need to detect out-of-plane motion in the Z direction, it is difficult to realize variable area sensitive capacitors due to the limitations of MEMS technology. Existing solutions mostly use variable gap parallel plate capacitors, such as W. Geiger in Germany, etc. Human-designed gyro structure (Sensors & Actuators A, 95)
Since the sensitivity of the variable-gap plate capacitor is inversely proportional to the gap, in order to ensure high sensitivity, the gap between the plate electrodes should not be too large, which will cause a large air damping, and must work in a low-voltage or vacuum environment, and this type of capacitor Difficult to implement differential detection
Huikai Xie and others in the United States have designed a gyro structure (Sensors and Actuatorsa-Physical) that uses vertical comb capacitance for detection. This gyroscope is implemented in a CMOS MEMS process, but its sensitive capacitance depends on the interaction of the CMOS process. The number of layers and thickness of the wiring makes it difficult to obtain a large sensitive capacitance, and there is a large stress in the process, which limits the performance of the device

Method used

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  • Horizontal axis micromechanical gyroscope and its preparation method
  • Horizontal axis micromechanical gyroscope and its preparation method
  • Horizontal axis micromechanical gyroscope and its preparation method

Examples

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Embodiment 1

[0026] Embodiment 1: The following steps are adopted when making a single-ended unequal-height comb-tooth capacitance horizontal-axis micromechanical gyroscope:

[0027] 1. The starting material is double-throwing N-type (100) silicon wafer 18 (such as Figure 5a shown), the thickness is 400±10 microns;

[0028] 2, at first form silicon oxide 19 mask on silicon wafer 18, then on silicon wafer 18, form the compound mask (as shown in Figure 5 b) that photoresist 20 and silicon oxide 19 form, then use photoresist 20 as The deep groove 21 is etched by the mask, and the depth of the deep groove 21 determines the height difference between the lower ends of the fixed electrode 2 and the movable electrode 1;

[0029] 3. As shown in FIG. 5c, the photoresist mask 20 is removed, and the shallow groove 22 is etched using the silicon oxide 19 as a mask. The depth of the shallow groove 22 determines the gap between the movable electrode 1 and the glass substrate;

[0030] 4. If Figure 5...

Embodiment 2

[0034] Embodiment 2: The following steps are adopted when making a double-ended unequal-height comb capacitor horizontal axis micromechanical gyroscope:

[0035] 1. The initial process is consistent with the above single-end unequal-height comb micromechanical gyroscope process, that is, steps 1 to 6 in Example 1 are used, and then the following steps are carried out;

[0036] 2. If Figure 6a As shown, a composite mask composed of a photoresist mask 27 and an aluminum mask 28 is formed on the surface of the silicon wafer 18, and the photoresist is used as a mask to etch deep grooves 29;

[0037] 3. If Figure 6b As shown, the photoresist mask 27 is removed, the silicon wafer 18 is etched with the aluminum mask 28 as a mask, and the movable electrode 1 and the fixed electrode 2 of the capacitor are formed to complete the horizontal-axis micromachine of the double-terminal unequal-height comb capacitor. Gyro preparation.

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Abstract

The product comprises: an outer / inner frame, a drive electrode and a drive feedback electrode both with two group of lateral comb-tooth capacitors and movable electrodes connected to the outer frame, a drive-modal elastic beam, a detection electrode with two group of unequal vertical comb-tooth capacitors for difference detection with movable electrode connected to the inner frame, a detect-modal elastic beam as four group of combined torsion beams everyone with ends connected to former inner / outer frame respectively, and an anchor point fixed on substrate bottom and connected to the outer frame through the drive-modal beam. This invention is simple and fit to large-scale production, compatible to Z-axis gyro and accelerometer, and can be used for MIMU.

Description

technical field [0001] The invention relates to a capacitive micromechanical gyroscope and a preparation method thereof, in particular to a horizontal axis micromechanical gyroscope adopting vertical comb capacitance detection and a preparation method thereof. Background technique [0002] Micromachined gyroscopes are a class of inertial sensors that use the Coriolis force to measure the angular rate of rotation of an object. Due to the use of micro-electromechanical system (MEMS) technology, micro-mechanical gyroscopes have the advantages of small size, light weight, and low cost. They have very broad application prospects in inertial navigation, weapon guidance, automobiles, and consumer electronics. In order to obtain the complete information of the object's rotation, it is necessary to detect the angular velocity signals of three axes at the same time, which requires a three-axis gyroscope. A three-axis gyro can be realized by assembling three single-axis devices orthog...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/00G01P9/00G01C19/5733G01C19/5769
Inventor 杨振川闫桂珍刘雪松郝一龙武国英
Owner PEKING UNIV
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