38results about How to "Enable high-volume manufacturing" patented technology

This invention provides a high accurate tunnel accelerometer structure and its process method, which comprises the following steps: first etching on the silicon pad and determining the initial distance between tunnel head to the electrode; keeping etching the tunnel head and depositing metal on the head as tunnel current emission electrode; processing drive electrode and tunnel head electrode on the glass underlay; positive electrode bonding to realize the underlay and silicon pad alignment and sticking; etching the silicon back with dry deep groove etching process to generate supportive beam; keeping etching silicon pad back to generate mass block and releasing structure to get the accelerometer.

The invention relates to a method for manufacturing a silicon-penetrating coaxial line for a microwave frequency band. The method is characterized by comprising the following steps of: photoetching a coaxial line pattern on an oxide layer at the A side of a silicon slice (1) and etching coaxial line through holes by using a deep reactive plasma etching process, wherein the depth of each coaxial line through hole is smaller than the thickness of the silicon slice; sputtering a seed layer on the A side of a silicon slice (2), covering a layer of photoconductive BCB (Benzocyclobutene) and photoetching to obtain the plated pattern of the coaxial line; then, aligning the A sides of the silicon slices (1 and 2) by using a BCB linkage process and linking at a low temperature; grinding the B side of the silicon slice (1) by using a chemical mechanical polishing process until through holes are exposed, and plating the coaxial line; and finally, grinding the silicon slice (2) from the B side to remove metal on the seed layer. By adopting wafer-level processes compatible with a microelectronics process, such as photoetching, and the like, the invention ensures the accuracy of a transmission line and can realize the mass manufacture. The silicon-penetrating coaxial transmission line lessens the influence on the microwave performance when a signal passes by the silicon slice in high-density three-dimensional encapsulation and avoids the great loss of the silicon-penetrating transmission line.

The invention relates to a micro type optics apparatus and the preparing process thereof, which is characterized in that: the apparatus includes fixed electrode, moveable electrode, supporting beam, glass substrate, light reflecting module and fiber fixed module; the fixed electrode includes the comb type fixed electrode connected to the double sides of the top surface of the glass substrate and the flat type fixed electrode fixed to the middle part of the glass substrate top surface; the moveable electrodes are two comb type moveable electrodes inserted equipped between the comb type fixed electrodes and two flat type movable electrodes equipped above the flat type fixed electrode; the supporting beam includes folding beam and combined torsion beam, the light reflecting module is the center above the fiber fixed module which is equipped with several fiber grooves in radiation type, and every fiber groove is separately focused to one of many light reflecting surfaces above the light reflecting module. The invention is easy to prepare, and is compatible with many kinds of types of MEMS components processes, which can be used for realizing more powerful micro optical integrated system.

The invention relates to a photoelectric encoder suitable for various motors, in particular high-speed and high-precision motors, and supports 32 million lines and 600,000 rpm. The photoelectric encoder is divided into a passive optical coding component mounted on a rotor, a light source + photoelectric conversion + a data acquisition processing module mounted on a stator. The encoder supports absolute and incremental encoding. The passive optical components of different specifications are manufactured through mass production or precision machining in the form of matryoshka dolls by using integrated circuits or micro-electromechanical and precision mold processes. Higher speeds and resolutions are supported as the manufacturing processes are improved. The encoder uses a microlens array toincrease sensitivity, and uses the microlens array to form a spot of a special pattern, thereby increasing a tolerance threshold and facilitating to install and use. The performance indicators of thelight source, a photosensor, a lens array, the passive optical coding component, etc. used by the encoder are related to coding accuracy, the speed, and device size.

The invention discloses an integrated electrode slapper exploder. The integrated electrode slapper exploder comprises an integrated electrode assembly and an acceleration bore. A reflector plate is arranged on the lower surface of the end of the integrated electrode assembly in a matched mode. The acceleration bore is arranged on the upper surface of the end of the integrated electrode assembly. The end of the integrated electrode assembly is tightly clamped between the acceleration bore and the reflector plate. A slapper layer and explosion foil are stacked up and down to be located between the acceleration bore and the end of the integrated electrode assembly. An acceleration bore hole is formed in the position, corresponding to the center of the explosion foil, of the acceleration bore. The integrated electrode assembly is formed by sequentially pressing a lower insulating layer, a lower electrode core layer, a middle insulating layer, an upper electrode core layer, an upper insulating layer, the explosion foil and the slapper layer. The lower electrode core layer is in circuit connection with one end of the explosion foil, and the upper electrode core layer is in circuit connection with the other end of the explosion foil. According to the integrated electrode slapper exploder, the upper electrode core layer, the explosion foil and the lower electrode core layer form a circuit loop. After the explosion foil is powered up, electrical explosion can generate plasma to impact the slapper layer, the slapper layer is made to fly out of the acceleration bore hole of the acceleration bore, and percussion charging is performed to achieve the detonation function of slappers.

The invention relates to a large-scale welding method for carbon nano tube devices. A carbon nano tube is deposited on a wafer including a graphical electrode by adopting a dielectrophoresis method, the wafer is placed on a carrying table of a radio-frequency induction heating system for heating for a short time, the wafer is cooled under the condition of vacuum or protective gas, a heating coil is set according to an electrode pattern. The welding method includes the following steps of: A. dispersing carbon nano tubes; B. connecting a positioning and orientating bridge of the nano tubes between an electrode pair; and C. connecting the carbon nano tubes with the electrode in a welding manner. The large-scale welding method has the advantages of adopting a radio-frequency induction heating method, being simple in process, fast in welding speed, good in repeatability and high in reliability, and being capable of realizing production on a large scale, and realizing large-scale effective welding of the wafer-level carbon nano tube devices.

The invention discloses a double-cavity valveless piezoelectric pump provided with convolution line flow pipes and having a computer CPU water cooling function. The double-cavity valveless piezoelectric pump comprises a hexagon head bolt, a pump cover, an O-shaped ring, a piezoelectric vibrator, an annular ring, a sealing ring, a pump body, a nut, an inlet pipe and an outlet pipe. The pump body is provided with a hexagonal head bolt hole, a sealing ring groove, a second flow channel, an annular ring groove, a pump cavity, a first flow channel, a liquid inlet and a liquid outlet. The pump body and the piezoelectric vibrator are connected in a sealed manner. The bottom of the pump cavity protrudes to form a sector with the central angle of 225 degrees. The piezoelectric pump utilizes the piezoelectric vibrator to generate volume change of the pump cavity so as to realize directional conveying of fluid; the two convolution line flow pipes and the sector-shaped pump cavity are arranged, so that the pump-out amount is increased; the piezoelectric pump has the advantages of small size, low power consumption, no electromagnetic interference, simple structure and the like; and the piezoelectric pump has the wide market prospects in the fields of computer chip cooling and the like.

The invention relates to a variable rigidity beam, a manufacturing method and an actuating method thereof. The variable rigidity beam comprises a frame structure, a filling part nested in the frame structure, an insulating layer positioned on the filing part and a heating component positioned on the insulating layer. The variable rigidity beam of the invention has the technical characteristics of monolithic integration and good adaptivity, wide application and high additional value, and can overcome the shortcomings in the existing technology.

The invention belongs to the technical field of contact preparation, and relates to a preparation method of a composite contact, which comprises the following steps: pre-pressing a contact material by using a powder metallurgy process to obtain a contact pre-pressing block, placing the contact pre-pressing block in a contact assembly mold, filling the contact assembly mold with a contact base material, pre-pressing to obtain a contact pre-pressing block, and carrying out hot pressing on the contact pre-pressing block to obtain the composite contact. Pressing and sintering the contact pre-pressing block in powder metallurgy equipment to prepare a contact assembly, and assembling the contact assembly to form a composite contact; the contact material comprises copper-chromium alloy powder and strengthening particles, and the strengthening particles are one of Cr2Nb powder, Al2O3 powder and WCu powder. The contact area of the moving contact and the static contact is replaced by the anti-ablation and anti-corrosion copper-chromium alloy dispersion reinforcing material, so that the anti-ablation and anti-corrosion performance of the area is improved by more than 50%.