Minitype optical device and method for producing the same

An optical device and micro technology, applied in optical components, optics, opto-mechanical equipment, etc., can solve problems that are not conducive to the miniaturization of equipment, increase the difficulty of system maintenance, reduce system reliability, etc., to reduce difficulty and cost, and improve functions. Powerful, high-isolation effects

Active Publication Date: 2008-08-20
PEKING UNIV
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will increase the cost of equipment, reduce system reliability, increase the difficulty of system maintenance and is not conducive to the miniaturization of equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Minitype optical device and method for producing the same
  • Minitype optical device and method for producing the same
  • Minitype optical device and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Embodiment 1: When making a micro-optical device with a single-ended unequal-height support beam, the following processes are mainly adopted:

[0041] 1. The starting material is a double-polished N-type (100) silicon wafer 11 (as shown in FIG. 6a ), with a thickness of 400±10 microns;

[0042] 2. Form a silicon oxide mask 12 on the silicon wafer 11, and then etch a deep groove 13. The depth of the deep groove 13 determines the gap between the fixed electrode 3 and the movable electrode 5 on the glass substrate;

[0043] 3. As shown in FIG. 6b, the silicon oxide mask 12 is removed, and the surface of the silicon wafer 11 is doped with boron 14 by ion implantation or diffusion process to form an ohmic contact;

[0044] 4. As shown in FIG. 6c, metal electrodes 15 are fabricated on the glass substrate 8 as lead electrodes of the micro-drive structure;

[0045] 5. As shown in FIG. 6d, the glass substrate 8 and the silicon wafer 11 are anodically bonded, and the silicon waf...

Embodiment 2

[0048] Embodiment 2: When making a micro-optical device with unequal-height support beams at both ends, the following processes are mainly used:

[0049] 1. The starting material is a double-polished N-type (100) silicon wafer 11 (as shown in FIG. 6a ), with a thickness of 400±10 microns;

[0050] 2. First, a silicon oxide mask 19 is formed on the silicon wafer 11, and then a photoresist mask 20 is formed on the surface of the silicon oxide mask 19 (as shown in FIG. 7 a ), and then a composite mask of silicon oxide and photoresist is formed. Then take the photoresist 20 as the mask etching deep groove 21 (as shown in Figure 7b), the depth of deep groove 21 determines the lower end of combined torsion beam 7 and folded beam 6 (comprising beams such as 71,72,73) height difference (as shown in Figure 7c);

[0051] 3. Remove the photoresist mask 20, and use the silicon oxide mask 19 as a mask to etch the silicon wafer 11 to form a deep groove 22. The depth of the deep groove 22 d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to a micro type optics apparatus and the preparing process thereof, which is characterized in that: the apparatus includes fixed electrode, moveable electrode, supporting beam, glass substrate, light reflecting module and fiber fixed module; the fixed electrode includes the comb type fixed electrode connected to the double sides of the top surface of the glass substrate and the flat type fixed electrode fixed to the middle part of the glass substrate top surface; the moveable electrodes are two comb type moveable electrodes inserted equipped between the comb type fixed electrodes and two flat type movable electrodes equipped above the flat type fixed electrode; the supporting beam includes folding beam and combined torsion beam, the light reflecting module is the center above the fiber fixed module which is equipped with several fiber grooves in radiation type, and every fiber groove is separately focused to one of many light reflecting surfaces above the light reflecting module. The invention is easy to prepare, and is compatible with many kinds of types of MEMS components processes, which can be used for realizing more powerful micro optical integrated system.

Description

technical field [0001] The invention relates to an optical device and a preparation method thereof, in particular to a micro-optical device with mixed functions of an optical switch and a variable optical attenuator and a preparation method thereof. Background technique [0002] Optical switches and variable optical attenuators realized by microelectromechanical systems (MEMS) technology have the advantages of small size, light weight, low energy consumption, and stable performance. With the rapid development of optical fiber communication technology and dense wavelength division multiplexing system, MEMS optical switches and variable optical attenuators, as important optical waveguide devices, have been more and more widely used. There have been many reports on the research on MEMS optical switches and variable optical attenuators. These devices are designed, manufactured and packaged in the form of discrete devices, and can well realize the function of optical switching o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G02B26/08G03F7/00B81C1/00
Inventor 陈庆华吴文刚王子千闫桂珍郝一龙王阳元
Owner PEKING UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap