Micro-drive structure for implementing coplane and off-plane movement

A technology of micro-drive and motion, applied in the direction of micro-structure technology, micro-structure devices, manufacturing micro-structure devices, etc., can solve the problem of limited device performance and application fields, difficult co-planar and out-of-plane motion, single co-planar drive structure or Problems such as out-of-plane movement can be achieved to achieve mass production, reduce internal stress, and improve quality

Active Publication Date: 2009-11-11
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the electrostatic driving method is limited by the driving principle and process technology. Generally, the driving structure can only achieve a single in-plane or out-of-plane motion, and it is difficult to achieve both in-plane and out-of-plane motion, which greatly limits the performance and application fields of the device.

Method used

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  • Micro-drive structure for implementing coplane and off-plane movement
  • Micro-drive structure for implementing coplane and off-plane movement
  • Micro-drive structure for implementing coplane and off-plane movement

Examples

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Effect test

Embodiment 1

[0041] Embodiment 1: When making a micro-drive structure of a single-ended unequal-height support beam, the following processes are mainly adopted:

[0042] 1. The starting material is double-throwing N-type (100) silicon wafer 11 (such as Figure 6a shown), the thickness is 400±10 microns;

[0043] 2. Form a silicon oxide mask 12 on the silicon wafer 11, and then etch a deep groove 13. The depth of the deep groove 13 determines the gap between the fixed electrode 3 and the movable electrode 5 on the glass substrate;

[0044] 3. If Figure 6b As shown, the silicon oxide mask 12 is removed, and the surface of the silicon wafer 11 is doped with boron 14 by ion implantation or diffusion process to form an ohmic contact;

[0045] 4. If Figure 6c Shown, make metal electrode 15 on glass substrate 8, as the lead electrode of micro-drive structure;

[0046] 5. If Figure 6d As shown, the glass substrate 8 and the silicon wafer 11 are anodically bonded, and the silicon wafer 11 i...

Embodiment 2

[0049] Embodiment 2: When making the micro-drive structure of the double-end unequal height support beam, the following processes are mainly used:

[0050] 1. The starting material is double-throwing N-type (100) silicon wafer 11 (such as Figure 6a shown), the thickness is 400±10 microns;

[0051] 2. At first, silicon oxide mask 19 is formed on silicon wafer 11, and then photoresist mask 20 is formed on silicon oxide mask 19 surface (such as Figure 7a shown), and then form a composite mask of silicon oxide and photoresist; then use photoresist 20 as a mask to etch deep grooves 21 (such as Figure 7b shown), the depth of the deep groove 21 determines the lower end height difference between the combined torsion beam 7 and the folded beam 6 (comprising 71, 72, 73 etc. beams) (as Figure 7c shown);

[0052] 3. Remove the photoresist mask 20, and use the silicon oxide mask 19 as a mask to etch the silicon wafer 11 to form a deep groove 22. The depth of the deep groove 22 deter...

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Abstract

The invention relates to a micro-drive structure for realizing co-planar and out-of-plane motion and a preparation method thereof. The micro-drive structure of the present invention includes a fixed electrode, a movable electrode, a support beam, a glass substrate, and a drive output end; the fixed electrode includes The comb-shaped fixed electrodes connected to both sides of the top surface of the glass substrate and the plate-shaped fixed electrodes fixed in the middle of the top surface of the glass substrate; the movable electrodes are inserted in the comb-shaped fixed electrodes There are two comb-shaped movable electrodes between them and two flat-plate movable electrodes respectively located above the flat-plate fixed electrodes; the supporting beam includes a folded beam and a combined torsion beam. The present invention can not only realize the coplanar X-axis movement through the interaction between the comb-shaped movable electrode and the fixed electrode, but also realize the out-of-plane torsional movement of the drive output end through the interaction between the movable electrode and the fixed electrode. The invention has a simple technological process, is compatible with various types of MEMS device techniques, and can be used to realize a more powerful micro-light integrated system.

Description

technical field [0001] The invention relates to a driving structure and a preparation method thereof, in particular to a micro-driving structure capable of realizing in-plane and out-of-plane motion and a preparation method thereof. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) have broad application prospects in national defense and civilian fields, and are now attracting much attention as an emerging technology. Micro-actuator, as a key drive component to realize micro-operation, is the core of MEMS. In micro-electromechanical systems, micro-actuators can realize multi-dimensional motion functions through in-plane motion and out-of-plane motion. Multi-dimensional motion micro-actuators have important and extensive application prospects in MEMS. For example, compared to sensors based on single-dimensional motion drives, sensors based on multi-dimensional motion drives (such as multi-dimensional position sensors, multi-dimensional force sensors and m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/02H02N13/00B81C1/00
Inventor 吴文刚陈庆华王子千闫桂珍郝一龙王阳元
Owner PEKING UNIV
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