Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Release film

A technology for peeling off film and base materials, which is applied in capacitor manufacturing, fixed capacitance parts, laminated capacitors, etc., which can solve the problems of slurry repelling, static electricity generation, and small hole formation, and achieve the effect of preventing adhesion and static electricity

Active Publication Date: 2006-10-04
LINTEC CORP
View PDF3 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of using the release film described in JP-A No. 10-22927, when the rolled release film is unrolled, static electricity may be generated
When such static electricity is generated, it becomes difficult to unwind the rolled release film
In addition, impurities such as dust or dirt may adhere to the release film, thereby causing defects such as slurry repelling or pinhole formation when coating ceramic slurry onto the release film

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Release film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] First, a substrate composed of a first substrate layer and a second substrate layer both made of polyethylene terephthalate (PET) was formed by a co-extrusion method. The surface roughness Ra of the outer surface of the first base material layer was 5 nm and the thickness of the first base material layer was 6 μm. On the other hand, the surface roughness Ra of the outer surface of the second base material layer was 20 nm and the thickness of the second base material layer was 32 μm.

[0072] Furthermore, 100 parts by weight of a silicone resin ("KS847H", manufactured by Shin-Etsu Chemical Co., Ltd.) and 1 part by weight of a curing agent ("CAT-PL5OT", manufactured by Shin-Etsu Chemical Co., Ltd.) were diluted with toluene. .manufacturing) to prepare a coating liquid having a solid content of 1% by weight.

[0073] The coating liquid thus obtained was then applied on the upper surface of the first substrate layer using a mayer bar #4, and then dried by heating at a temp...

Embodiment 2

[0082] First, the same substrate as used in Example 1 was prepared.

[0083] On the other hand, 100 parts by weight of a mixture of a silicone-modified alkyd resin and an amino resin ("KS-882", manufactured by Shin-Etsu Chemical Co., Ltd.) and 1 part by weight of p-toluenesulfonate were diluted with toluene Acid (curing agent) to prepare a coating liquid with a solid content of 2% by weight.

[0084] The coating liquid thus obtained was then applied on the upper surface of the first substrate layer using a Meyer rod #4, and then dried by heating at a temperature of 140° C. for 60 seconds to form a release film having an average thickness of 0.2 μm agent layer.

[0085] Further, the coating liquid thus obtained was applied on the lower surface of the second substrate layer using a Meyer rod #4 and then dried by heating at a temperature of 140° C. for 60 seconds to form an antistatic coating having an average thickness of 0.2 μm. Floor.

[0086] Release films were prepared as...

Embodiment 3

[0088] A release film was produced in the same manner as in Example 1, except that the substrate was formed so that the surface roughness Ra of the outer surface of the first substrate layer was 5 nm, the thickness of the first substrate layer was 6 μm, and the thickness of the outer surface of the second substrate layer was The surface roughness Ra was 15 nm, and the thickness of the second base material layer was not more than 32 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
roughnessaaaaaaaaaa
roughnessaaaaaaaaaa
roughnessaaaaaaaaaa
Login to View More

Abstract

A release film that can be used as a carrier film for a green sheet used in laminated ceramic capacitor is provided. The release film includes a base material having two major surfaces, a releasing agent layer provided on one major surface of the base material and an antistatic layer provided on the other major surface of the base material. The releasing agent layer and the antistatic layer are mainly made of the same material such as silicone-based resins. The surface roughness of the outer surface of the releasing agent layer defined as Ra1 (nm) and the surface roughness of the outer surface of the antistatic layer defined as Ra2 (nm) meet the conditions Ra1<=15 and Ra1<Ra2. The release film is capable of preventing blocking when being wound in a rolled form for storage and generation of static electricity when being unwound.

Description

technical field [0001] The present invention relates to a release film, and more particularly to a release film that can be used as a carrier film for a green sheet used in a laminated ceramic capacitor. Background technique [0002] The release film is used, for example, as a base film for green sheets used in laminated ceramic capacitors. [0003] In recent years, ceramic layers in multilayer ceramic capacitors have become thinner. In this case, if the surface roughness of the release agent layer provided on the release film substrate is high, there is a possibility that such as slurry Material repulsion or the formation of small holes defects. [0004] In order to solve such problems, a release film formed of a base material and a release agent layer having low surface roughness (ie, having high smoothness) provided on the base material may be employed. However, such a release film may cause problems such as blocking, wrinkle formation, and the like when the release fi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G13/00B29D7/01B32B27/00B32B27/36C08J7/044
CPCC08J2423/06C08J2367/02C08J7/04Y10T428/2495Y10T428/265Y10T428/24942Y10T428/24355Y10T428/31786C08J7/044B32B7/06B32B27/08B32B27/20B32B27/36B32B2307/538B32B2307/746B32B2307/748B32B2457/16
Inventor 高桥亮深谷知巳杉崎俊夫
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products