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Heat radiation pipe structure and its making method

A manufacturing method and catheter technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electrical components, etc.

Inactive Publication Date: 2006-10-11
GETAC TECH CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to solve the problem of waste heat removal efficiency of electronic components existing in the above-mentioned prior art. In response to the development of small volume, high density and high efficiency, the waste heat of electronic components is expected to be improved. The present invention Then provide a heat dissipation pipe structure and its manufacturing method, the heat conduction material of the present invention is applied to the heat dissipation pipe to improve the heat dissipation efficiency of the chip

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  • Heat radiation pipe structure and its making method
  • Heat radiation pipe structure and its making method
  • Heat radiation pipe structure and its making method

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Embodiment Construction

[0045] First, see figure 2 , which shows a heat dissipation pipe die method according to an embodiment of the present invention. This type of punching die includes a molding material supply device 21 , a molding material injection device 22 and a mold set 23 . Then the mold material is injected into the mold cavity 24 of the mold set 23 through the mold material injection device 22 for molding, and its shape is a hollow tube with one end not yet closed and a cylinder inside the tube. And the mold material can be a metal material or a molten material including a metal and a carbon element with a frame structure. The metal is copper or aluminum or silver or other metals with high thermal conductivity or their combined materials. Moreover, the melting point of the carbon element in the framework structure is higher than that of any metal mentioned above, so it can be combined in it to form a molding material.

[0046] read on figure 2 One end of the hollow tube body and the...

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Abstract

The wafer radiating pipe comprises a column body, the fluid, a capillary tissue, and a hollow closed pipe made of the conductive material and composed by metal and backbone-frame carbon with high thermal conductivity. Wherein, the material can be prepared by CVD, PVD, electroplating, or other material while cladding the carbon on metal surface or doping into metal directly. Besides, this invention can also be used on other devices.

Description

technical field [0001] The present invention relates to a heat dissipation pipe structure and a manufacturing method thereof, in particular to a manufacturing method of a heat conduction material comprising a metal and a carbon element with a frame structure. Background technique [0002] With the rapid development of today's technology and the rapid development of high-tech industries, electronic components are developing in the direction of small size and high density. If the waste heat cannot be removed in a timely manner, the performance of the electronic components will be reduced, or even damaged. In view of this, various heat-conducting materials emerge as the times require, hoping to achieve the purpose of improving heat dissipation efficiency. [0003] From the perspective of the prior art, copper or aluminum alloy is usually the mainstream of the current heat dissipation technology as the material applied to the heat dissipation structure. However, traditional al...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427B23P15/26
Inventor 黄明汉郑裕强陈兆逸郭欣陇李秉蔚萧惟中李秉峰
Owner GETAC TECH CORP