Method for improving circuitboard welding quality and air knife device therefor

A technology of welding quality and welding method, which is applied in the field of circuit board welding, can solve the problems of poor penetration tin welding effect and poor welding reliability, and achieve the effect of reducing ion residue and improving environmental reliability

Inactive Publication Date: 2006-11-15
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for improving the welding quality of circuit boards and an air knife device applied in the above method, so as to solve the problems of poor welding reliability or poor tin penetration welding effect in the prior art

Method used

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  • Method for improving circuitboard welding quality and air knife device therefor
  • Method for improving circuitboard welding quality and air knife device therefor
  • Method for improving circuitboard welding quality and air knife device therefor

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Embodiment Construction

[0027] refer to figure 1 As shown, a circuit board wave soldering method is provided, the method includes the steps of: 1, spraying flux on the circuit board; 2, blowing the flux sprayed on the lower surface of the circuit board into the through hole in the circuit board, To increase the amount of flux coating in the through hole and flush the OSP coating on the hole wall, improve the solderability of the hole wall, and improve the tin penetration ability of through hole welding; 3. The flux sprayed on the solder mask on the lower surface of the circuit board Remove it, reduce the ion residue after the circuit board is soldered, and improve the environmental reliability of the circuit board; 4. Preheat the circuit board; 5. Solder the circuit board through a wave soldering machine to complete the welding process.

[0028] In the above circuit board wave soldering method, in the step of blowing the flux sprayed on the lower surface of the circuit board into the through hole of ...

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PUM

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Abstract

This invention discloses a method for improving solder quality of CB and a device, in which, the method includes: spraying scaling powder on the CB, blowing the scaling powder on the lower surface of the CB in the through--ole of the CB to increase the coating volume of the powder in the through-hole and wash out the OSP coating of the hole wall to increase the solder ability of the hole, removing the scaling powder coated on the solder resistant film of the lower surface of the CB to reduce residual ions of the welded CB, preheating the CB welding the CB by a wave crest welder.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a circuit board welding technology. Background technique [0002] With the strengthening of environmental protection requirements, more and more countries or regions require that electronic products sold in the country need to be lead-free. For this reason, in the production of electronic products, when using wave soldering to solder circuit boards, it is necessary to use environmentally friendly non-organic solvents. Now people usually use VOC-free (Volatility Organic Compound-free) flux. However, due to the high surface tension of the VOC-free flux, the sprayed VOC-free flux cannot effectively completely wet the through holes of the circuit board, especially for the circuit boards that are surface-treated by the OSP process, after soldering, the through holes The penetration height of the solder in it is very small, which cannot meet the requirements of soldering rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B08B5/02B23K3/08
Inventor 陈普养
Owner HUAWEI TECH CO LTD
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