Laser processing method and device

A laser processing method and laser processing technology, applied in laser welding equipment, metal processing equipment, optics, etc., can solve the problems of not being able to improve laser utilization efficiency, and achieve the effects of improving utilization efficiency, easy rotation control, and efficient processing

Inactive Publication Date: 2006-12-20
OLYMPUS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is possible to change the incident angle of the microscope to enter a diffraction order, even this cannot improve the utilization efficiency of the laser

Method used

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  • Laser processing method and device
  • Laser processing method and device

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no. 1 Embodiment approach

[0059] A laser processing apparatus according to a first embodiment of the present invention will be described.

[0060] Such as figure 1 As shown, the laser processing apparatus 100 of this embodiment is an apparatus that divides wavelengths by λ 2 ,λ 3 Laser L 2 , L 3 as modulated light L M Laser processing is performed by irradiating the workpiece 15 .

[0061] Examples of the workpiece 15 include glass substrates, semiconductor substrates, and the like used in liquid crystal displays and the like. In this case, the processing target includes a wiring pattern on a substrate, a defect such as a useless residue existing on a photomask used for exposure, and the like.

[0062] Although not particularly shown, if necessary, the workpiece 15 is held on a mounting table having, for example, a holding mechanism for fixing a position during processing, an adsorption mechanism, and a moving mechanism for moving a processing position. In addition, when used in a microdissecti...

no. 2 Embodiment approach

[0127] A laser processing apparatus according to a second embodiment of the present invention will be described.

[0128] Figure 5 It is a schematic explanatory drawing for demonstrating the schematic structure of the laser processing apparatus 110 which concerns on 2nd Embodiment of this invention.

[0129] Such as Figure 5 As shown, the laser processing apparatus 110 of this embodiment has the laser source 130 instead of the laser oscillator 1 of the laser processing apparatus 100 of 1st Embodiment of this invention. The following description will focus on differences from the first embodiment.

[0130] The laser source 130 oscillates laser light L with different wavelengths in a pulsed manner A , L B (Wavelengths are λ A ,λ B ), a laser source that emits them as approximately parallel beams onto the same optical path. Its schematic structure consists of laser oscillators 1A, 1B, and a dichroic mirror 2 .

[0131] Laser L A , L B The size of the beam diameter can...

no. 3 Embodiment approach

[0152] Next, a laser processing apparatus according to a third embodiment of the present invention will be described.

[0153] FIG. 6 is a schematic explanatory diagram illustrating a schematic configuration of a laser processing apparatus 200 according to a third embodiment of the present invention.

[0154] As shown in FIG. 6, the laser processing apparatus 200 of this embodiment divides the wavelengths by λ according to the processing pattern. 2 , lambda 3 Laser L 2 , L 3 as modulated light L M Laser processing is performed by irradiating the workpiece 15 .

[0155] The laser light L can be used differently according to the wavelength absorption characteristics of the workpiece 15, etc. 2 , L 3 .

[0156] The general structure of laser processing device 200 is to be made up of following parts: laser oscillator 1 (laser source), tilt table 104 (rotation mechanism), micromirror array 7 (spatial modulator element, active optical element), tilt table 105 (rotation mechan...

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PUM

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Abstract

Disclosed is a laser processing method and device, wherein the processing method includes irradiating laser to micromirror array which is arranged regularly by many small mirrors from laser oscillator which can product laser (L2, L3), changing into sectional modulated light (LM) that corresponds to process-graphics of processed material, irradiating to the processed material through exposed optical system to do the laser processing, thus the direction of optical axis of exposed optical system and the direction of diffracted light produced by laser (L2,L3) through over micromirror should be coincident approximately.

Description

technical field [0001] The invention relates to a laser processing method and device. For example, it relates to a laser processing method and apparatus for removing, cutting, and the like of a predetermined region of a workpiece by irradiating laser light. [0002] This application claims priority based on Japanese Patent Application No. 2005-178286 filed on June 17, 2005 and Japanese Patent Application No. 2005-187829 filed on June 28, 2005, the contents of which are incorporated herein. Background technique [0003] Conventionally, there is known a laser processing apparatus that processes a desired region of a workpiece by irradiating laser light. For example, in the manufacture of liquid crystal displays or the like, a laser repair device is known as a means for correcting defects such as wiring patterns on glass substrates or unnecessary residues present on photomasks used for exposure. [0004] In these laser processing apparatuses, the size of the laser irradiation...

Claims

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Application Information

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IPC IPC(8): B23K26/06B23K26/04G02B26/08G02B27/00
Inventor 松沢聪明中村达哉
Owner OLYMPUS CORP
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