Photoelectric sensor, optical module and method of producing same

Abstract

An optical module is formed with a semiconductor optical element sealed inside a transparent resin part and a lens unit affixed to its upper surface. The-lens unit has a lens part that is disposed facing opposite the semiconductor optical element through the transparent resin part. A planar part extends from the lens part along the upper surface of the transparent resin part. A photoelectric sensor may include such an optical module as a light projector and another such optical module as a light receiver.

Description

[0001] This application claims priority from Japanese Patent Application No. 2005-304759 filed on October 19, 2005. technical field [0002] The present invention relates to an optical module, such as a light projection and receiving unit of a photoelectric sensor, and to a method of manufacturing such an optical module and a photoelectric sensor having such an optical module. Background technique [0003] Regarding an optical module of a photosensor for object detection, it is necessary to combine a semiconductor optical element such as a light emitting diode (LED), a laser diode (LD) or a photodiode (PD) with the above semiconductor optical element such as a light projection lens or a light receiving lens, etc. The position of the element corresponding to the set lens is precisely matched. If this position matching is not achieved with sufficient precision, projection or reception of light will not proceed as intended, and detection of objects will not be accurately achiev...

AI Technical Summary

Problems solved by technology

Therefore, if there is a positional deviation between them, the variation in the behavior of the generated light becomes large to cause a problem of lower yield

[0017] Another problem is that as the lens becomes thinner, if an eject pin is used to remove the lens from the mold when it is manufactured by injection molding, the eject pin is likely to penetrate and damage the lens

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