Release agent of bonding agent in epoxies, and preparation method

Abstract

This invention discloses a method for preparing loosing agent for epoxy resin adhesive. The loosing agent is prepared from: CH2Cl2 30-40 parts, cresol 12-18 parts, liquid paraffin 1-3 parts, formic acid 4-6 parts, and resin powder. The loosing agent has good loosing effect on epoxy resin adhesives. When the components to be loosed are soaked in the vessel containing the loosing agent at normal temperature for 1-2 h, the epoxy resin adhesives begin to be dissolved. The loosing agent has such advantages as rational formula, high dissolution ability for adhesives, low usage amount, and short soaking time, and can be used as a conventional solvent for repairing industry.

Description

technical field

[0001] The invention relates to a release agent capable of releasing adhesive-bonded workpieces and a preparation method thereof. Background technique

[0002] Adhesive bonding technology is widely used in the fields of production and life. Adhesives are used in the large parts between parts in machinery and equipment, as small as clothing, footwear and furniture in daily life. The development of modern science and technology has greatly improved the performance of the binder. For example, between the alloy blade and the handle bonded by the binder, the bonding strength is so high that it can be used in destructive tests. , instead of breaking at the bonding part but breaking at other parts. Among the adhesives, epoxy adhesives are the most widely used adhesives, which have the characteristics of strong bonding ability, good corrosion resistance, high electrical insulation performance and high mechanical strength. It is widely used in bonding between metals...

Examples

Embodiment 1

[0022] 30 ml of dichloromethane;

[0023] Cresol 16ml;

[0024] Liquid paraffin 1.6ml;

[0025] 4.8 ml of formic acid;

[0026] Resin powder 1.5ml.

[0027] During preparation, the resin powder is firstly added into dichloromethane to dissolve, then the three raw materials of cresol, liquid paraffin and formic acid are added in sequence, stirred and mixed, put into a glass container and sealed.

Embodiment 2

[0029] 35 ml of dichloromethane;

[0030] Cresol 12ml;

[0031] Liquid paraffin 1.3ml;

[0032] 4.2 ml of formic acid;

[0033] Resin powder 2ml.

[0034] The preparation method is the same as in Example 1.

Embodiment 3

[0036] 40 ml of dichloromethane;

[0037] Cresol 18ml;

[0038] Liquid paraffin 2.8ml;

[0039] 6 ml of formic acid;

[0040] Resin powder 2.8ml.

[0041] The preparation method is the same as in Example 1.

technical field

[0001] The invention relates to a release agent capable of releasing adhesive-bonded workpieces and a preparation method thereof. Background technique

[0002] Adhesive bonding technology is widely used in the fields of production and life. Adhesives are used in the large parts between parts in machinery and equipment, as small as clothing, footwear and furniture in daily life. The development of modern science and technology has greatly improved the performance of the binder. For example, between the alloy blade and the handle bonded by the binder, the bonding strength is so high that it can be used in destructive tests. , instead of breaking at the bonding part but breaking at other parts. Among the adhesives, epoxy adhesives are the most widely used adhesives, which have the characteristics of strong bonding ability, good corrosion resistance, high electrical insulation performance and high mechanical strength. It is widely used in bonding between metals...

Examples

Embodiment 1

[0022] 30 ml of dichloromethane;

[0023] Cresol 16ml;

[0024] Liquid paraffin 1.6ml;

[0025] 4.8 ml of formic acid;

[0026] Resin powder 1.5ml.

[0027] During preparation, the resin powder is firstly added into dichloromethane to dissolve, then the three raw materials of cresol, liquid paraffin and formic acid are added in sequence, stirred and mixed, put into a glass container and sealed.

Embodiment 2

[0029] 35 ml of dichloromethane;

[0030] Cresol 12ml;

[0031] Liquid paraffin 1.3ml;

[0032] 4.2 ml of formic acid;

[0033] Resin powder 2ml.

[0034] The preparation method is the same as in Example 1.

Embodiment 3

[0036] 40 ml of dichloromethane;

[0037] Cresol 18ml;

[0038] Liquid paraffin 2.8ml;

[0039] 6 ml of formic acid;

[0040] Resin powder 2.8ml.

[0041] The preparation method is the same as in Example 1.