Release agent of bonding agent in epoxies, and preparation method
A technology of epoxy resin and adhesive, applied in the direction of chemical instruments and methods, surface etching composition, etc., to achieve the effect of reasonable formula, short soaking time and strong dissolving ability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0022] 30 ml of dichloromethane;
[0023] Cresol 16ml;
[0024] Liquid paraffin 1.6ml;
[0025] 4.8 ml of formic acid;
[0026] Resin powder 1.5ml.
[0027] During preparation, the resin powder is firstly added into dichloromethane to dissolve, then the three raw materials of cresol, liquid paraffin and formic acid are added in sequence, stirred and mixed, put into a glass container and sealed.
Embodiment 2
[0029] 35 ml of dichloromethane;
[0030] Cresol 12ml;
[0031] Liquid paraffin 1.3ml;
[0032] 4.2 ml of formic acid;
[0033] Resin powder 2ml.
[0034] The preparation method is the same as in Example 1.
Embodiment 3
[0036] 40 ml of dichloromethane;
[0037] Cresol 18ml;
[0038] Liquid paraffin 2.8ml;
[0039] 6 ml of formic acid;
[0040] Resin powder 2.8ml.
[0041] The preparation method is the same as in Example 1.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com