Unlock instant, AI-driven research and patent intelligence for your innovation.

Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof

A technology of light-emitting elements and light emission, which is applied in semiconductor/solid-state device manufacturing, electrical components, optics, etc., can solve the problems of reduced strength, ineffective extraction, energy loss, etc., and achieve the effect of thinning

Active Publication Date: 2007-05-30
SHARP KK
View PDF2 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] As mentioned above, since the leaked light is absorbed by other components outside the light-emitting element, it will cause a large energy loss as a whole
Therefore, there is such a defect that the light emitted from the LED chip cannot be effectively extracted, and the intensity of the light emitted from the light emitting surface decreases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
  • Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
  • Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0095] Hereinafter, embodiments of the light emitting diode chip of the present invention will be described in detail with reference to the drawings. 1 is a perspective view of a light-emitting element 1 according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view of the light-emitting element 1 in the longitudinal direction (a-a section), and FIG. 3 is a cross-sectional view of the light-emitting element 1 in the short-side direction (b-b section). , FIG. 4 is a cross-sectional view (c-c cross-section) of the light-emitting element 1 in the short-side direction.

[0096] As shown in FIGS. 1 to 4 , the LED chip 3 is mounted on the patch area and the electrode common portion (first metal portion) 8 on the upper portion (mounting surface) of the front layer 5 of the laminated substrate 4 . The LED chip 3 is a semiconductor chip made of a GaN-based semiconductor material, and has electrode terminals (not shown) made of an anode electrode and a cath...

no. 2 Embodiment approach

[0115] FIG. 9 is a perspective view of a liquid crystal panel backlight 20 in a second embodiment of the present invention. The structure of the light emitting element 1 shown in FIG. 9 is the same as that of the light emitting element 1 in the first embodiment. As shown in FIG. 9 , the side wall opening surface 12 of the light emitting element 1 is bonded to the reflective sheet 16 via a light-transmitting adhesive. The light guide plate 30 is in contact with the reflection sheet 16 , and the light emitted from the light emitting element 1 and incident on the light guide plate 30 is moderately scattered to illuminate the liquid crystal panel 31 from the back. Generally, the reflective sheet 16 is used together with the side-emission LED that illuminates a thin display such as a liquid crystal panel from the side, and the reflective sheet 16 becomes a part of the backlight unit of the liquid crystal panel together with the light guide plate 30 . In the present invention, the ...

no. 3 Embodiment approach

[0126] Hereinafter, other embodiments of the present invention will be described based on FIGS. 12 to 16 .

[0127] FIG. 12 is a perspective view of a structural example of a light emitting element 500 according to this embodiment.

[0128] FIG. 13 is a cross-sectional view showing the detailed structure of the light emitting element 500 .

[0129] 14 is a diagram showing an example of the etching pattern of each layer constituting the metal reflector 502 and the laminated substrate 506, wherein (a) shows the first layer 521, (b) shows the second layer 522, and (c) shows the third layer. In the layer 523 , (d) shows the fourth layer 524 , (e) shows the fifth layer 525 , (f) shows the sixth layer 526 , (g) shows the seventh layer 527 , and (h) shows the eighth layer 528 .

[0130] As shown in FIG. 12 , the light-emitting element 500 of this embodiment has: an LED chip 501 mounted on a laminated substrate 506; The mounting surface completely surrounds the LED chip 501 , reflec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A light-emitting component includes: at least an LED chip mounted on a mounting face of a substrate; a metal reflecting plate arranged uprightly on a light emitting direction of the LED chip, and arranged on the mounting face and fully enveloping the entourage of the LED chip to reflect the emitted light of the LED chip and guide it to a light emitting surface mounted on the light emitting direction; and a first, a second metal unit formed on a region envelopped by the metal reflecting plate on the mounting face, used as electrode terminals for supplying drive current to the LED chip so as to be electrically connected with the LED chip respectively; a first metal film formed at an outer side of an insulating portion in the region, used as a metal reflecting film of the mounting face, the first metal film is contacted with the metal reflecting plate.

Description

technical field [0001] The present invention relates to a light emitting element suitable for illuminating a thin display body such as a liquid crystal panel from the side and a manufacturing method thereof, and also to a backlight unit including a light emitting element and a manufacturing method thereof. Background technique [0002] Conventionally, as a backlight light source for illuminating a display panel such as a liquid crystal from the side, the invention disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-223082, publication date: August 18, 2005) and the like has been used. Light-emitting elements such as side-emitting light-emitting diodes (hereinafter referred to as "LED: Light Emiting Diode"). [0003] As shown in Figure 11, the light-emitting element 101 includes: a chip substrate 114, formed with a patch (Die Bond) pattern 108 and an electrode terminal 109; LED chip 103, is installed on the chip substrate 114; The electrode termina...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/00H01L25/075H01L21/50G02F1/13357G02F1/1335H01L33/48
CPCH01L2224/48091H01L2224/48247H01L2224/48464H01L2224/49113H01L2924/00014
Inventor 竹本理史泷口治久绪方伸夫鹈饲健一
Owner SHARP KK