Penetrating support structure and its production

A support structure and penetrating technology, applied in the field of plate-shaped heat conduction elements, can solve problems such as affecting heat dissipation efficiency, blocking steam flow, and steam cannot circulate

Active Publication Date: 2007-06-20
奇科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Known patents related to the supporting structure of heat dissipation elements, such as Chinese Invention Patent Application No. 92128413 "Thin Plate Heat Pipe and Its Manufacturing Method", as shown in Fig. , 12 against each other to achieve the purpose of the support structure, the patent also mentions a solid straight groove support structure, as shown in Figure 2, a solid straight groove 21 is formed inside the housing 20 However, the two structures disclosed in the above-mentioned patents all have a common shortcoming, that is, the groove 12 and the solid straight groove 21 block the fluidity of the steam (vapor-phase working fluid), thereby affecting the heat dissipation efficiency
[0005] Another example is China's utility model patent application No. 93220197 "improvement of uniform temperature heat conduction structure", utility model patent application No. 93205027 "heat pipe", utility model patent application No. Application No. 86115415 "Heat Pipe Radiator", Utility Model Patent Application No. 88210055 "Heat Pipe Vapor" and other patents all propose a solid straight groove support structure similar to that shown in Figure 2, so The common disadvantage is that the solid straight groove support structure blocks the flow of steam (vapor-phase working fluid), thus affecting the heat dissipation efficiency
[0006] Another example is China's utility model patent application No. 87222042 "circular heat pipe flattened into flat heat pipe structure (1)", which proposes a section that can be a solid circle or a solid circle with grooves or a hollow circle, square or A square support structure with grooves, reticular capillary tissue or sintered capillary tissue is used to support and provide liquid capillary flow. Referring to Fig. The molds 20, 21 sandwich the pipe body 10 up and down to form a flat heat pipe structure. A serious disadvantage of this structure is that the support body 12 is attached to the capillary tissue 11 at a single point. As shown i

Method used

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  • Penetrating support structure and its production
  • Penetrating support structure and its production
  • Penetrating support structure and its production

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Embodiment Construction

[0072] The technical means and functions adopted to achieve the object of the present invention will be described below with reference to the accompanying drawings, and the implementations listed in the following accompanying drawings are only exemplary, and the technical means of the application are not limited to the accompanying drawings.

[0073] The penetrable support structure provided by the present invention is suitable for liquid-vapor two-phase thin vapor chambers or plate-shaped heat pipes, and can be applied to heat dissipation, soaking or heat transfer of heating elements in general electronics, optoelectronics, and communication products. Or computer chips, CPUs, monitors, LEDs, LCDs, light-emitting diodes, mobile phones, PDAs, video games, industrial computers, servers, etc., or general household appliances, refrigeration and air conditioning, automobiles, factory machinery, power plants, solar panels, chemical reactors, etc. heat dissipation, heat removal, heat ...

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Abstract

The inventive structural support is made of the braided wire or is made of sheet or block material to form a sheet-shaped concave-convex structure with several throughholes by punching, etching, electroplating or electroforming processes. The structural support is combined in the cavity of liquid-vapour two phases cooling assembly and is fit with a capillary structural layer.

Description

technical field [0001] The present invention relates to a penetrable supporting structure and a manufacturing method thereof, in particular to a liquid-vapor two-phase planar heat conduction element used for heat dissipation elements such as heat pipes, flat heat pipes, steam tank heat spreaders, and thin heat spreaders. The flexible support structure in the element has the dual effects of supporting and avoiding expansion and deformation, thereby facilitating the flow of working fluid and achieving high-efficiency heat uniformity or heat dissipation. Background technique [0002] With the increasing function speed of electronic products and the pursuit of light, thin and small volume, the heat dissipation problem of electronic products and components (such as computer CPU) is becoming more and more serious. In order to solve the heat dissipation problem, many passive heat dissipation and heat equalization components have been proposed as solutions to the heat dissipation pr...

Claims

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Application Information

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IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/046F28D15/0233
Inventor 陈绍文徐金城周政泰叶岚凯江家升林鸿辉
Owner 奇科技股份有限公司
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