Penetrating support structure and its production

A support structure and penetrating technology, applied in the field of plate-shaped heat conduction elements, can solve problems such as affecting heat dissipation efficiency, blocking steam flow, and steam cannot circulate

A support structure and penetrating technology, applied in the field of plate-shaped heat conduction elements, can solve problems such as affecting heat dissipation efficiency, blocking steam flow, and steam cannot circulate

CN1982826AActive Publication Date: 2007-06-20奇科技股份有限公司
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  • Penetrating support structure and its production
  • Penetrating support structure and its production
  • Penetrating support structure and its production

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Experimental program
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Embodiment Construction

[0072] The technical means and functions adopted to achieve the object of the present invention will be described below with reference to the accompanying drawings, and the implementations listed in the following accompanying drawings are only exemplary, and the technical means of the application are not limited to the accompanying drawings.

[0073] The penetrable support structure provided by the present invention is suitable for liquid-vapor two-phase thin vapor chambers or plate-shaped heat pipes, and can be applied to heat dissipation, soaking or heat transfer of heating elements in general electronics, optoelectronics, and communication products. Or computer chips, CPUs, monitors, LEDs, LCDs, light-emitting diodes, mobile phones, PDAs, video games, industrial computers, servers, etc., or general household appliances, refrigeration and air conditioning, automobiles, factory machinery, power plants, solar panels, chemical reactors, etc. heat dissipation, heat removal, heat ...

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Abstract

The inventive structural support is made of the braided wire or is made of sheet or block material to form a sheet-shaped concave-convex structure with several throughholes by punching, etching, electroplating or electroforming processes. The structural support is combined in the cavity of liquid-vapour two phases cooling assembly and is fit with a capillary structural layer.

Description

technical field [0001] The present invention relates to a penetrable supporting structure and a manufacturing method thereof, in particular to a liquid-vapor two-phase planar heat conduction element used for heat dissipation elements such as heat pipes, flat heat pipes, steam tank heat spreaders, and thin heat spreaders. The flexible support structure in the element has the dual effects of supporting and avoiding expansion and deformation, thereby facilitating the flow of working fluid and achieving high-efficiency heat uniformity or heat dissipation. Background technique [0002] With the increasing function speed of electronic products and the pursuit of light, thin and small volume, the heat dissipation problem of electronic products and components (such as computer CPU) is becoming more and more serious. In order to solve the heat dissipation problem, many passive heat dissipation and heat equalization components have been proposed as solutions to the heat dissipation pr...

Claims

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Application Information

Patent Timeline
20 Jun 2007
Publication
CN1982826A
IPC
F28D15/02; F28D15/04
CPC
F28D15/046; F28D15/0233
Inventors
陈绍文; 徐金城