Liquid crystal display and manufacturing method thereof

a technology of liquid crystal display and manufacturing method, which is applied in the field of liquid crystal display, can solve the problems of crosstalk, the opening ratio of the liquid crystal display cannot be increased, and the parasitic capacity cdp is increased, and achieves the effects of low crosstalk, high quality, and hardly increasing parasitic capacity cdp

Inactive Publication Date: 2001-05-31
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

0041] Accordingly, an object of the present invention is to provide a TFT-LCD (LCD is an abbreviation of liquid crystal display) of high quality i

Problems solved by technology

When the parasitic capacity Cdp becomes large, a problem of crosstalk occurs.
In other words, there arises a problem that, as the crosstalk occurs when decreasing the distance between the picture element electrode 114 and the source line 107, it is necessary to secure a distance exceeding a certain value between the picture element electrode and the source line.
As a result, opening ratio of the liquid crystal display cannot be increased.
As discussed above, in the picture element structure of the conventional TFT array substrate, there is a problem that when decreasing the distance between the picture element electrode and the source line to improve the opening ratio, the parasitic capacity Cdp is increased, eventually resulting in occurrence of crosstalk.
It is well known that if the variation is large, there arises a flicker in image plane, and a phenomenon (hereinafter referred to printing) takes place in which when a pattern is continuously displayed for a long time, the same pattern still remains after being switched to the other pattern, wh

Method used

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  • Liquid crystal display and manufacturing method thereof
  • Liquid crystal display and manufacturing method thereof
  • Liquid crystal display and manufacturing method thereof

Examples

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example 2

[0097] Example 2 of the invention is hereinafter described.

[0098] The manufacturing method of the picture element section according to this example 2 is same as that shown in example 1, as far as the manufacturing steps before forming a Cs line 11a are concerned.

[0099] As shown in FIG. 9, the Cs line 11a dose not form a line section parallel to the gate line 2 in the picture element, but is arranged and formed above the source line 7 and an adjacent source line 7 through the source insulating film by overlapping a part of a picture element electrode 14a on the adjacent gate line 2. The Cs line 11a is not formed into a ring being different from example 1, but is arranged along the longitudinal direction (shorter direction than lateral direction) of liquid crystal panel. As a result, the line resistance can be restrained to be small as compared with the arrangement in lateral direction.

[0100] By forming the picture element electrode 14a shown in FIG. 9, the distance between the source...

example 3

[0102] Example 3 of the invention is hereinafter described.

[0103] FIG. 10 is a plane view showing a picture element of the liquid crystal display according to example 3 of the invention. The picture element shown in FIG. 10 is arranged forming a matrix and forms a display section.

[0104] In the drawing, reference numeral 201 indicates a source line, numeral 202 indicates a gate line arranged crossing over the source line 201, and numeral 203 is a Cs line forming a Cs capacity which is arranged along the gate line 202 and formed in the same manufacturing step as that of the gate line 202.

[0105] Numeral 204 is a semiconductor layer forming a channel of TFT, and numeral 205 is a picture element electrode forming a display section and is formed in a region defined by the source line 201 and the gate line 202. Numeral 206 is a drain electrode of TFT which is connected to the picture element electrode 205. The semiconductor 204, the source line 201, the gate line 202 and the drain electrod...

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Abstract

Parasitic capacity between Cs lines and source lines forming a picture element section is reduced, whereby characteristic resistant to crosstalk is achieved, opening ratio is increased, and brightness of LCD is increased. The Cs lines are arranged on the source lines in such a manner as to cover the source lines, and picture element electrodes are arranged and formed on the Cs lines in such a manner as to partially overlap. By forming a structure in which the source lines, the Cs lines and the picture element electrodes are laminated in order, parasitic capacity between the Cs lines and the source lines forming a picture element section can be reduced, and crosstalk can be minimized. As a distance between the source lines and the picture element electrodes can be reduced from the viewpoint of a plan view, opening ratio can be improved.

Description

[0001] 1. Field of the invention[0002] The present invention relates to a liquid crystal display provided with a thin film transistor array substrate for use in matrix type display and to a manufacturing method thereof.[0003] 2. Description of the prior art[0004] Generally, a matrix type display comprises a thin film transistor array substrate (hereinafter referred to as TFT array substrate) on which a thin film transistor (hereinafter referred to as TFT) is formed, and an opposition substrate on which color filter, black matrix, etc. are formed. A display material such as liquid crystal is held between the mentioned two substrates, and in which a voltage is selectively applied to the display material.[0005] In the TFT array substrate, as shown in the equivalent circuit of FIG. 14, picture elements are arranged forming a matrix.[0006] In FIG. 14, reference numerals G1, G2, G3 indicate scanning signal lines (hereinafter referred to as gate lines), and numerals S1, S2, S3 indicate ima...

Claims

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Application Information

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IPC IPC(8): G02F1/1345G02F1/1362G02F1/136
CPCG02F1/1345G02F1/136213G02F1/136
Inventor NAKAYAMA, AKIONUMANO, YOSHINORI
Owner MITSUBISHI ELECTRIC CORP
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