48 results about "Crosstalk minimization" patented technology

A method and apparatus for achieving multicolor displays using an integrated color chip is provided. The integrated color chip contains one or more multicolor generation sites on a single substrate. Each multicolor generation site is comprised of two or more light emitting regions in close proximity to one another, the number of light emitting regions per site dependent upon the number of required colors. The active light generation system for each light emitting region, e.g., an LED, is preferably identical in device structure although size and shape may vary. In order to achieve the desired colors, one or more light conversion layers are applied to individual light emitting regions. Each light emitting region may also include index matching layers, preferably interposed between the outermost surface of the light emitter and the light conversion layer, and protective layers. In order to minimize cross-talk and achieve improved contrast, opaque material is preferably deposited between adjacent light emitting regions. Cross-talk may also be minimized by locating the light emitting regions on a substantially non-reflective substrate.

A system for redistributing a multiple input audio / video and data signals having a redistributing device equipped to receive signals in a multiple formats and redistribute a selected signal to a user's premises over conductors, preferably existing twisted-pair telephone wire. The redistributing device is in interactive communication with a communications interface located in the user's premises which receives user-input control signals and contains switching circuitry which routes the selected signal to the user's premises where it is received by the receiving unit such as a television receiver. A single redistributing device services an entire multi-user network from a common distribution point, and services multiple users independently. The system of the invention does not interfere with normal use of the telephone network, so users can interactively access services provided by the system and use the telephone at the same time. In one preferred embodiment the system of the invention dynamically allocates frequencies and modulation techniques to various output signals, to maximize spectral efficiency and minimize interference and cross-talk.

In a discrete multi-tone modem, a method of minimizing cross talk over a twisted pair of a twisted pair cable binder in which discrete multi-tone data transmission is utilized comprises the steps of one of jointly minimizing near end cross talk while maximizing total data rate, jointly minimizing an arbitrary function of total power while maximizing total data rate and minimizing total near end cross talk for a given data rate, selecting a function to be optimized and performing a bit and power allocation algorithm responsive to the selected function. The process may be combined with known optimization functions such as jointly minimizing an average bit error rate while maximizing the data rate. As a result, the process is considerably more flexible and adaptable to changing parameters such as environmental parameters impacting data transmission performance in the presence of cross talk. Either a telecommunications central office modem or a remote terminal modem may be so adapted to apply such a cross talk minimization method.

The invention is an electrical connector that minimizes signal skew caused by varying propagation times through different transmission paths within the connector, minimizes crosstalk caused by intermingling electric fields between signal contacts, and maximizes signal density within the connector. The electrical connector may include a plug and receptacle housing, plug contacts, receptacle contacts, and contact plates. The contact plates may include connecting contacts that electrically connect plug contacts to receptacle contacts. The electrical connector minimizes signal skew by maintaining substantially equal-length transmission paths within the connector through varying the lengths and positions of plug and receptacle contacts. The electrical connector minimizes crosstalk by surrounding the connecting contacts with electrical ground by placing the connecting contacts in grooves of the connecting plates. Placing the contacts in such grooves maximizes the signal density of the contact by enabling the contacts to be placed in close proximity with other contacts while minimizing crosstalk.

The embodiments described herein relate to multi-core optical fiber interconnects which include at least two multi-core optical fibers. The multi-core optical fibers are connected such that the core elements of the first multi-core optical fiber are optically coupled to the core elements of the second multi-core optical fiber thereby forming an array of interconnect core elements extending through the optical fiber interconnect. The multi-core optical fibers are constructed such that cross-talk between adjacent core elements in each multi-core optical fiber are minimized. The multi-core optical fibers are also constructed such that time-delays between the interconnect core elements in the array of interconnect core elements are also minimized.

A solid state imaging system has at least one CMOS imager with first and second series of pixels in which the pixels of one series are offset, i.e., staggered, in respect to the pixels of the other series. Multiple imagers can be arrayed end to end, with jumper wires connecting the pixel output conductors or each so that the pixels feed into a common output amplifier for each series, to minimize chip to chip offset voltages. The pixels may be diagonally offset from one another, and a color imager can be constructed in which color ribbon filters are arranged diagonally across the imaging area. This arrangement minimizes color cross talk. An array of microlenses is situated with each microlens covering a plurality of the pixels. The different pixels under each microlens can be aligned along a diagonal. The different pixels under the same microlens can have different integration times, to increase the dynamic range of the imager(s).

A high performance, high capacitance gain, electric connector for data transfer applications. At least eight sequentially positioned elongate contact members are connected in a series of signal pairs. A first signal pair includes a fourth contact member and a fifth contact member. A second signal pair includes a third contact member and a sixth contact member. In addition, a third signal pair comprises a first contact member and a second contact member. Finally, a seventh and an eighth contact member are in a fourth signal pair. One member of each contact member pair is configured differently from the other member of the pair, the respective contact members being oriented relative to one another such that they substantially remain in generally parallel planes, but define non-parallel paths. Each of the third and fifth contact members mounts a plate-like extension oriented in a first direction and in respective planes generally parallel to one another. Each pair of extensions are separated by a first dielectric such that a first capacitor is formed. Furthermore, each of the fourth and sixth contact members mounts a plate-like extension oriented in a second direction and also in respective planes generally parallel to one another. Each pair of extensions are likewise separated by a second dielectric such that a second capacitor is formed. Each contact of each contact member pair has a plug engaging portion and a board engaging portion, the plurality of contact members having a selected shape, being arranged relative to one another, and being housed collectively by a dielectric casing so as to minimize crosstalk during data transfer.

A flat panel display device has a transistor in which cross-talk is minimized. The flat panel display device includes a substrate, a first gate electrode formed on the substrate, a first electrode insulated from the first gate electrode, a second electrode insulated from the first gate electrode and surrounding the first electrode in the same plane, a semiconductor layer insulated from the first gate electrode and contacting the first electrode and the second electrode, and a display element including a pixel electrode electrically connected to one of the first electrode and the second electrode.

A method of minimizing crosstalk in an IC package including (A) routing a first signal between first pads and a first trace layer in an congested area, (B) routing the first signal between the first and second trace layers in an non-congested area, (C) routing the first signal between the second trace layer and first pins in the non-congested area, (D) routing a second signal between second pads and the first trace layer in the congested area, (E) routing the second signal between the first and the second trace layers in the congested area and (F) routing the second signal between the second trace layer and second pins in the non-congested area, wherein (i) all of the first and second pins are arranged along a line and (ii) the first pins are offset from the second pins by a gap of at least two inter-pin spaces.

In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plurality of stacked dielectric layers, with a conductor disposed on at least one of the plurality of dielectric layers. The mating interface includes a plurality of conductive vias aligned in a plurality of rows, with the plurality of conductive vias extending through at least a portion of the plurality of dielectric layers, at least one of the plurality of conductive vias intersecting the conductor. The plurality of conductive vias includes signal conductor connecting conductive vias and ground conductor connecting conductive vias. For each of the plurality of rows of the conductive vias, there are at least twice as many ground conductor connecting conductive vias as signal conductor connecting conductive vias and the conductive vias are positioned relative to one another so that for each signal conductor connecting conductive via, there are ground conductor connecting conductive vias adjacent either side of the signal conductor connecting conductive via.

In a thin film transistor and a flat panel display device having the same, cross-talk is minimized. The flat panel display device includes a substrate, a first thin film transistor, a second thin film transistor, and a display element. The first thin film transistor includes: a first gate electrode formed on the substrate; a first electrode insulated from the first gate electrode; a second electrode insulated from the first gate electrode and surrounding the first electrode in the same plane; and a first semiconductor layer insulated from the first gate electrode and contacting the first electrode and the second electrode. The second thin film transistor includes: a second gate electrode formed on the substrate and electrically connected to one of the first electrode and the second electrode; a third electrode insulated from the second gate electrode; a fourth electrode insulated from the second gate electrode and surrounding the third electrode in the same plane; and a second semiconductor layer insulated from the second gate electrode and contacting the third electrode and the fourth electrode.

A semiconductor device having two thin film transistors where cross-talk is minimized and a flat panel display device having the same. The semiconductor device includes a first electrode, a second electrode surrounding the first electrode in the same plane, a third electrode surrounding the second electrode in the same plane, a fourth electrode surrounding the third electrode in the same plane, a first gate electrode insulated from the first through fourth electrodes and arranged on another plane separate from the first through fourth electrodes to correspond to a space between the first electrode and the second electrode, a second gate electrode insulated from the first through fourth electrodes and arranged on yet another plane separate from the plane of the first through fourth electrodes to correspond to a space between the third electrode and the fourth electrode, and a semiconductor layer insulated from the first gate electrode and the second gate electrode and contacting the first through fourth electrodes.

The invention provides a millimeter wave waveguide communication system. The millimeter wave waveguide communication system comprises a clock module and at least two groups of millimeter wave receiving / sending channels, wherein the clock module is used for respectively providing clock signals for the sending ends and receiving ends of the at least two groups of millimeter wave receiving / sending channels; each group of the millimeter wave receiving / sending channels comprises an emitter module, a receiving end module and a transmission waveguide, wherein the transmission waveguide is positioned between the emitter module and the receiver module and is used for providing a transmission channel for the millimeter wave; the areas on the top, side and / or bottom of the transmission waveguide, except part of areas on which active devices and accessories are arranged on, are plated with metal conductive walls to form electromagnetic shielding of the transmission waveguide in the adjacent millimeter wave receiving / sending channels. The metal conductive wall of the layer can minimize the crosstalk between the channels during high-speed communication, and therefore, data bandwidth and data throughput of the millimeter wave communication system are improved.

A novel flat-wire-pair cable and resonant filter termination employing active interconnect principles is disclosed. The invention implements flattened conducting wires coated with insulation that are bonded to each other, providing approximately rectangular cross-sections and flat surfaces for the transport of charge through the wires. The flat wire pair may then be twisted for additional cross-talk minimization, with the twist occurring simultaneously and in identical fashion on both wires due to their attached arrangement. The terminating ends of the cable are routed on an insulating substrate forming a connector body, with the traces ending in conducting structures providing a matched resonating filter function. This filter is tuned to provide maximal benefit for the highest significant spectral content in transmitted signals. Through these enhancements, the invention interconnect architecture substantially reduces signal loss due to skin-effect and eliminates intra-pair skew. Through its active interconnect design, it amplifies high-frequency content and recovers signal energy lost due to attenuation through the length of the cable and connector termination.

According to the present invention, when a land-groove recording method is adopted, thermal crosstalk between a land and an adjoining groove is suppressed effectively. Inhomogeneity of a recording layer between the land and groove is suppressed effectively. A substrate for optical recording media comprises groove-like concave parts (2) and convex parts each created between adjoining concave parts. A border sidewall (4) between a concave part and an adjoining convex part (2) has a plurality of sidewall planes, that is, at least a first sidewall plane (41) that leads to the bed of the concave part and a second sidewall plane (42) that leads to the apical plane of the convex part. The first sidewall plane meets the bed of the concave part at an angle ranging from 120° to less than 180°. The second sidewall plane meets the bed of the concave part at an angle ranging from 90° to 110°. A discontinuous part (6) is produced at least along a borderline between the first sidewall plane and second sidewall plane. The presence of the discontinuous part (6) is effective in minimizing thermal crosstalk between the concave part (2) and convex part (3) and suppressing inhomogeneity of a recording layer between a land and an adjoining groove.

A novel varied twist-rate wire pair and cable architecture are disclosed. The invention implements variable twist rate along twisted wire pair length, providing approximately equivalent physical and electrical length values for segments of such twisted wire pair, and consequently, low delay skew, and substantially minimized inter-pair crosstalk due to reduction of twist-rate correlation along the length of a UTP cable employing the invention. Due to the elimination of the need for shielding, the invention method yields flexible, low-cost cables that may be employed for extremely high data throughput applications such as HDMI. Minimized inter-pair skew also eliminates the need for channel re-alignment at the end of long cable runs. Through these benefits, the invention twisted pair and cable facilitates continued enhancements in multi-media electronics while containing cost for high-performance interconnect.

Parasitic capacity between Cs lines and source lines forming a picture element section is reduced, whereby characteristic resistant to crosstalk is achieved, opening ratio is increased, and brightness of LCD is increased. The Cs lines are arranged on the source lines in such a manner as to cover the source lines, and picture element electrodes are arranged and formed on the Cs lines in such a manner as to partially overlap. By forming a structure in which the source lines, the Cs lines and the picture element electrodes are laminated in order, parasitic capacity between the Cs lines and the source lines forming a picture element section can be reduced, and crosstalk can be minimized. As a distance between the source lines and the picture element electrodes can be reduced from the viewpoint of a plan view, opening ratio can be improved.

A microstrip antenna has a single dielectric layer with a conductive ground plane disposed on one side, and an array of spaced apart radiating patches disposed on the other side of the dielectric layer. The radiating patches are interconnected with a feed terminal via stripline elements. Responsive to electromagnetic energy, a high-order standing wave is induced in the antenna and a directed beam is transmitted from and / or received into the antenna. A dual-mode embodiment is configured such that standing wave nodes occur at the intersection of orthogonally situated striplines to minimize cross-polarization levels of the signals and the cross-talk between the two modes of operation.