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Semiconductor memory device

a semiconductor and memory device technology, applied in static storage, digital storage, instruments, etc., can solve the problems of increasing load, not affecting normal read operation, and affecting the normal operation of conventional semiconductor memory devices

Inactive Publication Date: 2005-04-07
LAPIS SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a semiconductor memory device with an MCD generator that can switch between standby and active states without experiencing delays. The device includes a voltage generator that generates a drain voltage to access the memory cells during read operation. The voltage generator has two generating means: a first generating means that generates the drain voltage with a predetermined driving performance when an operation enable signal is supplied, and a second generating means that generates the drain voltage with a lower driving performance regardless of the presence or absence of the operation enable signal. The second aspect of the invention is to temporarily set the drain voltage at a higher value when the operation enable signal is supplied to the voltage generator. The third aspect of the invention is to use feedback stop means to temporarily stop the feedback of the output voltage to increase the drain voltage when the operation enable signal is supplied. The fourth aspect of the invention is to make the voltage generator for each memory array and provide on-off control for each memory array to apply the drain voltage only to the selected memory array. The fifth aspect of the invention is to provide a voltage generator for every plurality of memory arrays and select the corresponding voltage generator to generate the drain voltage for the selected memory array. These technical effects improve the access speed and reliability of the semiconductor memory device.

Problems solved by technology

However, the conventional semiconductor memory device has following problems.
If the number of memory arrays and bit lines increase as a memory capacity increases, the entire length of wires through which the drain voltage MCD is supplied lengthens, thereby increasing a load caused by a parasitic capacitance of the wires and the like.
Accordingly, if a standby state is switched to an active state in response to the chip selection signal / CE, the rising of the drain voltage MCD to be applied to each memory array MA delays, causing a problem that a normal read operation is not effected.

Method used

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Examples

Experimental program
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Effect test

first embodiment

[0050]FIG. 1 shows a semiconductor memory device according to a first preferred embodiment of the present invention.

[0051] The semiconductor memory device has a drain voltage generator 10A which differs from the drain voltage generator 10 shown in FIG. 2.

[0052] This semiconductor memory device is a non-volatile semiconductor memory capable of an electrical writing. The semiconductor memory also has a plurality of memory cell arrays MAk (k=0 to p) for storing data therein. Each memory array MAk has the same configuration, and, for example, as shown in a memory array MA0, it has a plurality of word lines WLi (I=0 to m), which are arranged in parallel with one another, and a plurality of drain lines DLj (=0 to n) which are arranged to intersect the word lines WLi. Further, a plurality of source lines SLj are arranged in parallel with one another between each of the drain lines DLj and DLj +1.

[0053] Memory cells MCEi, j at the even numbered side are connected to the word lines WLi, d...

second embodiment

[0074]FIG. 3 is a circuit diagram of a drain voltage generator according to a second embodiment of the invention. A drain voltage generator 10B is provided in place of the drain voltage generator 10 shown in FIG. 2, and the common components which are common to those in FIG. 2 are depicted by common reference numerals.

[0075] The drain voltage generator 10B provides an NMOS19, a PMOS20, and a pulse generator 21 in the drain voltage generator 10 in FIG. 2. A source of the NMOS19 is connected to a node N1, and a drain thereof is connected to the power supply voltage VCC via the PMOS20. The pulse generator 21 generates a pulse signal PLS, which goes “H” for a definite period of time, at the falling of a chip selection signal / CE, and the pulse signal PLS is supplied to a gate of the NMOS19. A gate of the PMOS20 is connected to the ground voltage GND. Other configurations of the components are the same as those of the drain voltage generator 10 shown in FIG. 2.

[0076]FIG. 4 shows signal...

third embodiment

[0082]FIG. 5 is a circuit diagram of a drain voltage generator according to a third embodiment of the invention. A drain voltage generator 10C is provided in place of the drain voltage generator 10 shown in FIG. 2, and the components which are common to those in FIG. 2 are depicted by common reference numerals.

[0083] The drain voltage generator 10C has NMOSs 22, 23 which are serially connected to each other instead of the NMOS13 of the drain voltage generator 10 in FIG. 2, and also a pulse generator 21 for controlling the NMOS23, and an inverter24. A drain and a gate of the NMOS22 are connected to nodes N1, N2.

[0084] Further, the pulse generator 21 generates a pulse signal PLS which goes “H” for a definite period of time at the falling of a chip selection signal / CE, and the pulse signal PLS is inverted by the inverter 24, and the thus inverted pulse signal is supplied to a gate of the NMOS23 as a pulse signal / PLS. Other configurations of the components are the same as those show...

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Abstract

There is provided a semiconductor memory device capable of eliminating the occurrence of delays in access when switching from a standby state to an active state. A drain voltage generator 10A generates a predetermined drain voltage MCD which is low in driving performance owing to PMOS 15, 17 and NMOS 16, 18 each having large ON resistance irrespective of the presence of a chip selection signal and apply the drain voltage to each of memory arrays. When read operation is started when a chip selection signal / CE goes “L”, the drain voltage MCD is generated by PMOSs 11, 15 and NMOSs 12 to 14 with a predetermined driving performance. As a result, a predetermined drain voltage MCD is always applied when switching from a standby state to an active state, thereby eliminating the occurrence of delays in access to a memory cell.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The invention relates to an electrically writable non-volatile semiconductor memory device, particularly to a circuit for generating a drain voltage to be applied to a specific memory cell during read operation. [0003] This application is a counterpart of Japanese patent application, Serial Number 291116 / 2002, filed Oct. 3, 2002, the subject matter of which is incorporated herein by reference. [0004] 2. Description of Related Art [0005] There are following related related arts. [0006] JP 2000-11668A [0007] JP 1994-215585A [0008] JP 1994-342598A [0009]FIG. 2 is a circuit configuration showing an example of a conventional semiconductor memory device. [0010] This semiconductor memory device is an electrically writable non-volatile memory, and has a plurality of memory arrays MAk (k=0 to p). Each of the memory array MAk has the same configuration, and has a plurality of word lines WLi (I=0 to m), which are arranged in p...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G11C16/30G11C16/06
CPCG11C2207/2227G11C16/30
Inventor NAGATOMO, MASAHIKO
Owner LAPIS SEMICON CO LTD