Baths, methods, and tools for superconformal deposition of conductive materials other than copper

Inactive Publication Date: 2005-05-05
SEMITOOL INC
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  • Abstract
  • Description
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  • Application Information

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Benefits of technology

[0008] Through the use of the compositions, methods and tools of the present invention, conductive materials can be deposited superconformally into small, e.g., submicron, recessed features at rates that mi

Problems solved by technology

In certain situations, conventional baths are unable to form conductive features in recessed structures without voids that render the conductive featur

Method used

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  • Baths, methods, and tools for superconformal deposition of conductive materials other than copper
  • Baths, methods, and tools for superconformal deposition of conductive materials other than copper
  • Baths, methods, and tools for superconformal deposition of conductive materials other than copper

Examples

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example

Superconformal Electrolytic Deposition of Gold into Patterned Features

[0053] In this example, a silicon wafer including patterned features having a feature depth of 3.8 μm and an aspect ratio of 4:1 was processed to deposit gold into the patterned features superconformally. The patterned features included a titanium-based barrier layer 500 Å thick and a gold seed layer 500 Å thick. The titanium-based barrier layer and gold seed layer were deposited by sputtering. The wafer was contacted with the electroplating bath in an Equinox® brand single wafer plating tool available from Semitool, Inc. of Kalispell, Mont. The plating tool included an inert platinum anode. The plating was carried out at 50° C. The chemical flow rate was 3.5 gpm and the wafer was rotated at 40 rpm. The electroplating power was pulsed with 2 ms on and 8 ms off. The peak current density was 8 mA / cm2 and an average current density was 1.6 mA / cm2. This resulted in a plating rate of about 0.1 μm per minute.

[0054] The...

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Abstract

Superconformal deposition promoters are used to facilitate the superconformal deposition of conductive metals other than copper. Features deposited using the baths, methods, and tools that employ the superconformal deposition promoters are void free. The superconformal deposition promoters include sulfonate terminated alkanethiols, sulfonic acid terminated alkanethiols, carboxylate terminated alkanethiols, carboxylic acid terminated alkanethiols, and sulfonate terminated alkanedisulfide compounds.

Description

FIELD OF THE INVENTION [0001] The present invention relates to the electrolytic deposition of conductive materials other than copper, such as gold into recessed features. BACKGROUND OF THE INVENTION [0002] Gold is used in the microelectronics industry as a conductive material to fill recessed features. Examples of recessed features include trenches and vias. Trenches filled with gold serve as conductive lines and vias filled with gold serve as interlayer interconnects. Decreasing the sizes of conductive features and thus the recessed features which are used to form such conductive features places rigorous demands on existing electroplating chemistry to completely fill the recessed features. The expense of gold places additional pressure on manufacturers to consistently achieve void-free fill of recessed features in order to achieve high yields. [0003] In certain situations, conventional baths are unable to form conductive features in recessed structures without voids that render the...

Claims

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Application Information

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IPC IPC(8): C25D3/02C25D3/48C25D5/02C25D17/00
CPCC25D3/48C25D3/02
Inventor HU, ZHONGMINRITZDORF, THOMAS L.
Owner SEMITOOL INC
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