Radiation fin structure

Abstract

A radiation fin structure aims to disperse heat for personal or notebook computers and peripheral devices thereof. The structure includes a base deck at the bottom end of the radiation fins with grid type passages formed therein to form a closed loop. The closed loop is filled with a liquid or gas heat dissipation medium to the amount about 50% to 90% of the internal volume capacity of the grid type passages. When the base deck is in contact with the contact surface of a computer heat generating element, heat concentrates on the heat absorption end of the base deck and is transferred to the fin-type heat dissipation section to be dispelled by a fan to improve heat dissipation effect.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a radiation fin structure for improving heat dissipation. BACKGROUND OF THE INVENTION [0002] The radiator for personal computers or notebook computers generally has a fan fixedly mounted onto the radiation fins. The radiation fins are clamped on a computer heat generating element through an eccentric fixture. During heat dissipation process, the eccentric fixture is prone to skew and results in the radiation fins not in direct contact with the computer heat generating element. Therefore heat generated by the computer heat generating element concentrates on the contact surface, while airflow generated by the fan does not blow in a converged fashion but around the surrounding. Moreover, the radiation fins simply rely on metal thermal conduction principle to disperse heat. Namely, the computer heat generating element transfers heat through the contact surface to the base deck of the radiator. Then the heat is transferred to...

AI Technical Summary

Benefits of technology

[0004] The structure set forth can achieve the following advantages:

[0005] 1. The base deck at the bottom end of the radiation fins has grid type passages to form a closed loop to contain a liquid or gas heat dissipation medium. It maintains the original metal thermal conductive heat dissipation approach, also includes a medium convection heat dissipation approach. Therefore heat dissipation effect may be improved.

[0006] 2. The radiation fin structure according to the invention consists of aluminum radiation fins with a closed loop formed therein. Heat on the contact surface of the heat generating element (at a higher temperature) concentrates on the heat absorption end of the base deck, and passes through the radiation fins to be dispelled by the fan. Thus heat dissipation effect may be improved.

[0007] 3. The radiation fins of the invention are in contact with the contact surface of the heat generating element so that the heat absorption end of the base deck at the bottom can converge heat which passes through the radiation fins to be dispelled by the fan. The contact area is evenly formed and has an improved heat conduction coefficient. This also can enhance heat dissipation effect.

Problems solved by technology

During heat dissipation process, the eccentric fixture is prone to skew and results in the radiation fins not in direct contact with the computer heat generating element.

As solid substance has limited thermal conductivity power, heat dissipation effect of the known radiator also is limited.

Images