Substrate processing apparatus

a processing apparatus and substrate technology, applied in the direction of manufacturing tools, liquid/solution decomposition chemical coating, electric circuit machining, etc., can solve the problems of reducing the reliability of plated films, reducing the reliability of copper interconnections, and increasing the problem of copper interconnection defects, etc., to achieve low cost and without lowering the throughput of apparatus
US20050236268A1Inactive Publication Date: 2005-10-27EBARA CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
EBARA CORP
Publication Date
2005-10-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

A substrate processing apparatus has a plating apparatus configured to plate a substrate to deposit a metal on a surface of the substrate and an additional process apparatus configured to perform an additional process on the substrate. The plating apparatus has a substrate placement stage on which the substrate to be transferred to the additional process apparatus is placed. The additional process apparatus has an additional process unit configured to perform the additional process on the substrate and a substrate transfer device operable to transfer the substrate between the substrate placement stage of the plating apparatus and the additional process unit. The substrate processing apparatus can perform an additional process in addition to a plating process without lowering a throughput of the apparatus and can upgrade the additional process at a low cost.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a substrate processing apparatus having a plating apparatus for plating a substrate, and more particularly to a substrate processing apparatus having a plating apparatus for plating a substrate, such as a semiconductor wafer, a glass substrate, or an interposer, to form interconnections, such as large scale integrated circuits (LSI) or plugs, in a surface of the substrate. The present invention is particularly effective in reducing defects in interconnections which would be caused by a plating process.

[0003] 2. Description of the Related Art

[0004] Materials for interconnections such as LSI have changed from aluminum-based materials to copper-based materials. Accordingly, there has been a growing tendency to employ a plating process to form interconnections instead of a dry process such as chemical vapor deposition (CVD) or physical vapor deposition (PVD). Thus, plating apparatuses ...

Claims

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