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Laser beam processing machine

Inactive Publication Date: 2006-04-13
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013] Since the laser beams distributed to the first path and the second path by the path distribution means are output alternately in the laser beam processing machine of the present invention, they are converged in the inside of the workpiece with a time lag between them. Therefore, even when a laser beam passing through the first path and a laser beam passing through the second path are converged at focusing points which are displaced from each other on the optical axis, the laser beam having a deep focusing point is not obstructed by the other laser beam having a shallow focusing point.

Problems solved by technology

Therefore, in the case where the wafer is relatively thick, it takes long to form the deteriorated layer thick enough to divide the wafer precisely.
However, as this laser beam processing machine applies a laser beam with its focusing points displaced from each other on the same optical axis in the thickness direction of the wafer, a laser beam having a shallow focusing point obstructs the application of a laser beam having a deep focusing point, thereby making it impossible to form a desired deteriorated layer.

Method used

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first embodiment

[0021]FIG. 1 is a schematic diagram of a laser beam processing machine constituted according to the present invention. The illustrated machine comprises a chuck table 3 for holding a wafer 2 as a workpiece and a laser beam application means denoted by 4.

[0022] The chuck table 3 comprises an adsorption chuck 31 made from a porous member or having a plurality of suction holes or grooves, and the adsorption chuck 31 is communicated with a suction means that is not shown. Therefore, a protective tape 21 affixed to the side of a surface on which a circuit is formed, of the wafer 2 as the workpiece is placed on the adsorption chuck 31, and the wafer 2 is suction-held on the chuck table 3 by activating the suction means that is not shown. The thus constituted chuck table 3 is so constituted as to be moved in a processing-feed direction indicated by an arrow X in FIG. 1 by a processing-feed means that is not shown. Therefore, the chuck table 3 and the laser beam application means 4 can move...

second embodiment

[0040] A description is subsequently given of the laser beam application means 4 with reference to FIG. 3.

[0041] The laser beam application means 4 shown in FIG. 3 differs from the laser beam application means 4 shown in FIG. 1 in that the focusing point depth displacing means 73 is arranged in the second path 7b. This focusing point depth displacing means 73 is composed of one convex lens 733 and is interposed between the beam splitter 712 and the first mirror 74. Since the constitution of the laser beam application means 4 shown in FIG. 3 is substantially the same as that of the laser beam application means 4 shown in FIG. 1 except for the focusing point depth displacing means 73, the same members are given the same reference symbols and their descriptions are omitted.

[0042] In the laser beam application means 4 shown in FIG. 3, the vertically polarized light and the horizontally polarized light divided by the modulator 711a of the polarization conversion means 711 alternately ar...

third embodiment

[0044] A description is subsequently given of the laser beam application means 4 with reference to FIG. 4.

[0045] The laser beam application means 4 shown in FIG. 4 differs from the laser beam application means 4 shown in FIG. 1 in the path distribution means for distributing a pulse laser beam oscillated by the pulse laser beam oscillation means 5 to the first path 7a and the second path 7b alternately. That is, the path distribution means 72 in the embodiment shown in FIG. 4 is composed of a modulator 721 for dividing a pulse laser beam oscillated by the pulse laser beam oscillation means 5 into two different paths alternately and a pulse generator 722 for providing a sync signal for setting are petition frequency (f) to the pulse laser beam oscillation means 5 and a sync signal having a frequency (f) / 2 to the modulator 721. As the modulator 721 is used a modulation element making use of an acoustic-optic effect in the illustrated embodiment. By providing this path distribution mea...

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Abstract

A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a laser beam processing machine for applying a pulse laser beam capable of passing through a workpiece to form a deteriorated layer in the inside of the workpiece. DESCRIPTION OF THE PRIOR ART [0002] In the production process of a semiconductor device, a plurality of areas are sectioned by dividing lines called “streets” arranged in a lattice pattern on the front surface of a wafer comprising a suitable substrate such as a silicon substrate, sapphire substrate, silicon carbide substrate, lithium tantalite substrate, glass substrate or quartz substrate, and a circuit (function element) such as IC or LSI is formed in each of the sectioned areas. Individual semiconductor devices are manufactured by cutting the wafer along the dividing lines to divide it into the areas each having a circuit formed thereon. To divide the wafer, there are proposed various methods making use of a laser beam. [0003] U.S. Pat. No. 6,211,488 and J...

Claims

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Application Information

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IPC IPC(8): B23K26/06
CPCB23K26/0604B23K26/0613B23K26/067B23K26/0838B23K26/408B23K2201/40B23K26/40B23K2101/40B23K2103/52
Inventor KOBAYASHI, SATOSHINOMARU, KEIJIWATANABE, YOSUKE
Owner DISCO CORP
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