Bonding agent, aluminum nitride composite body, and manufacturing method of the same

Inactive Publication Date: 2006-05-25
NGK INSULATORS LTD
View PDF3 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0020] Moreover, the aluminum nitride composite body can be used in a heater including a heating element or an electrostatic chuck including an electrode. Such an aluminum nitride composite body can be obtained at a low bonding temperature of 1500° C. or less. Accordingly, the heating element and the electrode do not change in nature, and the volume resistivity thereof scarcely changes at bonding. Such heater and electrostatic chuck have therefore excellent capabilities.
[0021] A method of manufacturing an aluminum nitride composite body includes: heating a plurality of al

Problems solved by technology

Moreover, when the bonding is performed in a manufacturing process of the heater or electrostatic chuck, the heating element or electrodes might change in quality or the volume resistivity might change due to the high bonding temperature.
This might result in degradation of properties

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding agent, aluminum nitride composite body, and manufacturing method of the same
  • Bonding agent, aluminum nitride composite body, and manufacturing method of the same
  • Bonding agent, aluminum nitride composite body, and manufacturing method of the same

Examples

Experimental program
Comparison scheme
Effect test

examples

[0074] Next, the present invention is described in more detail with examples, but the present invention is not limited to the following examples.

examples 1 to 11

, Comparative Examples 1 to 3

(Aluminum Nitride Sintered Body)

[0075] 95 wt % of the aluminum nitride powder was added to 5 wt % of yttrium oxide as a sintering auxiliary agent and then mixed using a ball mill. The obtained powder mixture was added to the binder and granulated by spray granulation. The obtained granulated powder was molded into a plate and a pipe by die molding and CIP. The obtained plate compact and pipe compact were baked at 1860° C. for 6 hours in nitrogen gas by hot pressing and in nitrogen gas by atmospheric sintering, respectively.

[0076] In terms of size of the obtained aluminum nitride sintered bodies, the plate sintered body had 60 mm length×60 mm width and 20 mm thickness, and the pipe sintered body had 58 mm outer diameter, 20 mm inner diameter, and 20 mm length. The aluminum nitride sintered bodies were processed such that the flatness was 10 μm or less.

(Bonding Conditions)

[0077] Bonding agents shown in Tables 1 and 2 were uniformly applied to the bon...

example 12

[0098] The heater 20 shown in FIG. 2 was manufactured. A compact for the disk member 21 was formed using the granulated powder obtained in the same way as that of Examples 1 to 11 by die molding, and a compact for the pipe member 22 was formed by CIP. In the compact for the disk member 21, the heating element 24 which was coil-shaped and made of molybdenum was embedded. The obtained compact was baked at 1860° C. in nitrogen gas by hot pressing for 6 hours. In terms of size of the obtained aluminum nitride sintered bodies, the disk member 21 had 340 mm diameter and 20 mm thickness, and the pipe member 22 had 70 mm outer diameter, 60 mm inner diameter, and 180 mm length. The placement surface 21a of the disk member 21 was processed to have a flatness of 10 μm or less.

[0099] The bonding agent of Example 1 shown in Tables 1 and 2 was uniformly applied to the end surface 22a of the pipe member 22 such that the density of the bonding agent was 18 g / cm2. The back surface 21b of the disk m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Currentaaaaaaaaaa
Particle diameteraaaaaaaaaa
Login to view more

Abstract

A bonding agent comprises a flux containing either calcium aluminate or calcium oxide and aluminum oxide and containing less than 5 wt % rare-earth elements; and aluminum nitride powder.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. P2004-332377, filed on Nov. 16, 2004, and No. P2005-234999, filed on Aug. 12, 2005; the entire contents of which are incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a bonding agent to bond a plurality of aluminum nitride sintered bodies, an aluminum nitride composite body, and a method of manufacturing the same. [0004] 2. Description of the Related Art [0005] Conventional methods to bond aluminum nitride sintered bodies to each other include a solid state bonding method and a solid-liquid state bonding method. In the solid state bonding method, a bonding agent is interposed between the aluminum nitride sintered bodies, and bonding is performed in a state where the bonding agent is not melted, that is, the bonding agent is solid. The solid state...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B9/00B32B19/00
CPCB32B18/00B32B2315/02C04B35/581C04B35/62665C04B35/645C04B37/005C04B2235/3206C04B2235/3208C04B2235/3217C04B2235/3222C04B2235/3225C04B2235/3418C04B2235/3865C04B2235/77C04B2235/94C04B2235/96C04B2235/963C04B2235/9692C04B2237/062C04B2237/064C04B2237/08C04B2237/704C09J1/00
Inventor HATTORI, AKIYOSHITAKAHASHI, TAKAHIRO
Owner NGK INSULATORS LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap