Laser assisted material deposition

Abstract

Electronic devices and systems are provided with material structured from irradiation of a gas precursor with electromagnetic energy at a frequency tuned to an absorption frequency of the gas precursor. The frequency of the electromagnetic energy may be selected to impart specific amounts of energy to a gas precursor at a specific frequency that provides point of use activation of the gas precursor.

Description

RELATED APPLICATIONS [0001] This application is a Divisional of U.S. application Ser. No. 10 / 683,806, filed Oct. 10, 2003, which is incorporated herein by reference.FIELD OF THE INVENTION [0002] The present invention relates to electronic device fabrication, in particular, semiconductor device fabrication. BACKGROUND OF THE INVENTION [0003] Fabrication of electronic devices such as integrated circuits is performed through a series of processes, where each process has its own thermal characteristics. Some processes require high temperatures, while others not requiring high temperatures are performed at temperatures elevated over ambient. The elevated temperatures, whether small or large, provide an energic environment in which reactants, or precursors, interact chemically to form a desired material composition. This material composition may be an intermediate composition or the final composition forming an integral portion of the electronic device or system being constructed. [0004] ...

AI Technical Summary

Problems solved by technology

These heating processes may place limitations on the fabrication process.

For instance, reactant gases that can provide the desired resultant composition upon chemical reaction may be eliminated from being used because the chemistries of these gases may be sensitive to heating, making thermal control difficult.

In other instances, conventional heating methods may be inefficient for a wide variety of gases.

As these gases are heated, a significant percentage by mass volume may decompose into unwanted gas compositions prior to undergoing the intended chemical reaction with other materials or gases.

Then, only the non-decomposed portion of the volume of reactant gas contributes to the fabrication process, limiting the reaction efficiency.

Thus, control of the thermal characteristics for forming various materials to be used in electronic devices and systems provides a significant challenge for fabrication processes.

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