Laser-assisted orthogonal micro-cutting device and method having automatic laser focus following function

Abstract

The invention discloses a laser-assisted orthogonal micro-cutting device and method having an automatic laser focus following function, belongs to the technical field of machining equipment and aims to solve the problem that height changes of to-be-machined surfaces cannot be monitored in real time in laser-assisted micro-cutting processes in the prior art. A motion unit and a laser-assisted machining unit of the device are mounted on a shock-absorbing platform; an optical automatic following unit is arranged on the laser-assisted machining unit and comprises a lens A, a lens B and a linear array charge coupled device (CCD) sensor; laser emitted by a laser light source of the laser-assisted machining unit irradiates a to-be-machined surface via the lens A, and a laser beam reflected by the to-be-machined surface is focused on the linear array CCD sensor via the lens B; and the to-be-machined surface is mounted on the motion unit, and a computer control unit adjusts displacement of the to-be-machined surface in the direction X, the direction Y and the direction Z in real time by the aid of the motion unit according to the laser action range fed back by the linear array CCD sensor.

Description

technical field [0001] The invention belongs to the technical field of machining equipment, and in particular relates to a laser-assisted orthogonal micro-cutting device and method with automatic laser focus tracking. Background technique [0002] With the development of aerospace, national defense industry, and microelectronics industry, the demand for precise three-dimensional and complex micro-structural parts is increasingly urgent, and the requirements for use functions, material properties, structural shapes, reliability, and interchangeability are also increasing. High; in order to ensure the high safety and reliability of the system in severe environments such as high overload, high speed, and high rotation, a large number of materials (MMC) with high strength, light weight, high toughness, high ductility, and damage resistance are used. Small thin-walled cavities, curved surfaces and other complex, special-shaped, and integrated structures are more difficult to proc...

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Problems solved by technology

[0005] The purpose of the present invention is to propose a laser-assisted orthogonal micro-cutting device and method with automatic laser focus tracking, which solves the problem that the height change of the surface to be processed cannot be monitored in real time during the laser-assisted micro-cutting process in the prior art, and realizes the The processed surface follows the set laser action distance in real time

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