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Multi-use memory cell and memory array

a memory cell and multi-use technology, applied in the field of multi-use memory cells and memory arrays, can solve the problems of difficult fabrication and operation of three-terminal devices, complex solutions for achieving erasable or multi-state cells, and difficult work of chalcogenides

Inactive Publication Date: 2007-03-29
WODEN TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] The preferred embodiments will now be described with reference to the attached drawings.

Problems solved by technology

Some solutions for achieving erasable or multi-state cells are complex.
These memory cells are three-terminal devices which are relatively difficult to fabricate and operate at the very small dimensions required for competitiveness in modern integrated circuits.
Chalcogenides are difficult to work with and can present challenges in most semiconductor production facilities.

Method used

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[0095] Fabrication of a single memory level will be described in detail. Additional memory levels can be stacked, each monolithically formed above the one below it. In this embodiment, a polycrystalline semiconductor diode will serve as the switchable memory element.

[0096] Turning to FIG. 15a, formation of the memory begins with a substrate 100. This substrate 100 can be any semiconducting substrate as known in the art, such as monocrystalline silicon, IV-IV compounds like silicon-germanium or silicon-germanium-carbon, III-V compounds, II-VII compounds, epitaxial layers over such substrates, or any other semiconducting material. The substrate may include integrated circuits fabricated therein.

[0097] An insulating layer 102 is formed over substrate 100. The insulating layer 102 can be silicon oxide, silicon nitride, high-dielectric film, Si—C—O—H film, or any other suitable insulating material.

[0098] The first conductors 200 are formed over the substrate and insulator. An adhesion...

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Abstract

A multi-use memory cell and memory array are disclosed. In one preferred embodiment, a memory cell is operable as a one-time programmable memory cell or a rewritable memory cell. The memory cell comprises a memory element comprising a semiconductor material configurable to one of at least three resistivity states, wherein a first resistivity state is used to represent a data state of the memory cell when the memory cell operates as a one-time programmable memory cell but not when the memory cell operates as a rewritable memory cell. A memory array with such memory cells is also disclosed. In another preferred embodiment, a memory cell is provided comprising a switchable resistance material, wherein the memory cell is operable in a first mode in which the memory cell is programmed with a forward bias and a second mode in which the memory cell is programmed with a reverse bias.

Description

RELATED APPLICATIONS [0001] This application is a continuation-in-part of Kumar et al., U.S. application Ser. No. 11 / 237,167, “Memory Cell Comprising Switchable Semiconductor Memory Element with Trimmable Resistance,” filed Sep. 28, 2005 and hereinafter the '167 application, which is assigned to the assignee of the present invention and hereby incorporated by reference in its entirety.[0002] This application is related to Kumar et al., U. S. application Ser. No. xx / xxx,xxx, “Method for Using a Memory Cell Comprising Switchable Semiconductor Memory Element with Trimmable Resistance,” (Attorney Docket No. MA-163-1); to Fasoli et al., U.S. application Ser. No. xx / xxx,xxx, “Passive Element Memory Array Incorporating Reversible Polarity Word Line and Bit Line Decoders,” (Attorney Docket No. 023-0048); to Fasoli et al., U. S. application Ser. No. xx / xxx,xxx, “Method for Using a Passive Element Memory Array Incorporating Reversible Polarity Word Line and Bit Line Decoders,” (Attorney Docke...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L29/76
CPCG11C11/005H01L27/2463G11C11/5692G11C13/0007G11C13/003G11C17/14G11C2211/5641G11C2211/5646G11C2213/32G11C2213/71G11C2213/72G11C2213/76H01L27/101H01L45/08H01L45/1233H01L45/148H01L27/2409G11C11/5685H10B63/20H10B63/80H10N70/24H10N70/884H10N70/826
Inventor SCHEUERLEIN, ROY E.KUMAR, TANMAY
Owner WODEN TECH INC
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