Multi-use memory cell and memory array
a memory cell and multi-use technology, applied in the field of multi-use memory cells and memory arrays, can solve the problems of difficult fabrication and operation of three-terminal devices, complex solutions for achieving erasable or multi-state cells, and difficult work of chalcogenides
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[0095] Fabrication of a single memory level will be described in detail. Additional memory levels can be stacked, each monolithically formed above the one below it. In this embodiment, a polycrystalline semiconductor diode will serve as the switchable memory element.
[0096] Turning to FIG. 15a, formation of the memory begins with a substrate 100. This substrate 100 can be any semiconducting substrate as known in the art, such as monocrystalline silicon, IV-IV compounds like silicon-germanium or silicon-germanium-carbon, III-V compounds, II-VII compounds, epitaxial layers over such substrates, or any other semiconducting material. The substrate may include integrated circuits fabricated therein.
[0097] An insulating layer 102 is formed over substrate 100. The insulating layer 102 can be silicon oxide, silicon nitride, high-dielectric film, Si—C—O—H film, or any other suitable insulating material.
[0098] The first conductors 200 are formed over the substrate and insulator. An adhesion...
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