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Water Block And Manufacturing Method Thereof

a technology of water block and manufacturing method, which is applied in the direction of indirect heat exchangers, laminated elements, light and heating apparatus, etc., can solve the problems of under-achieving the heat dissipation efficiency, unable to meet the efficiency required for heat conduction, and overheating inevitably, so as to enhance the heat dissipation effect and improve the cooling tim

Inactive Publication Date: 2007-06-07
COOLER MASTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] Therefore, the present invention is to provide a water block having porous microchannels and its manufacturing method, and a thermal conducting powder is sintered to form a porous microchannel structure that can produce a turbulent flow effect on a coolant and greatly improve the staying time of coolant at the water block. Meanwhile, the contact surface area formed by the porous microchannel structure produces a heat exchange effect, such that the coolant can greatly absorb the heat of a heat source conducted from a heat generating component, so as to effectively enhance the heat dissipating effect.

Problems solved by technology

The operation of any electric appliance may cause overheats inevitably due to the issue of efficiency or friction.
A fan is a simple, easy and popular heat dissipating device which can produce a fast flow of air around a heat generating component by vanes, and quickly carry away the heat produced by heat generating components to achieve the heat dissipation effect, but the heat dissipating effect may not be able to satisfy the efficiency required for the heat conduction due to an insufficient heat dissipating area, and thus the actual heat dissipating efficiency is below the expected efficiency.
Further, a fan can be used for blowing and carrying away the heat source compulsorily, but the airflow volume of the fan is very limited, and the heat dissipating effect still cannot be improved effectively.
Thus, prior arts try to improve the airflow volume by connecting a plurality of fans in series, but such arrangement is limited by the available space and it is very difficult to implement.
Furthermore, an increase of the rotary speed of a motor for improving the airflow volume gives rise to a higher level of difficulty for manufacturing the motor, and the increase of the rotary speed of a motor has an upper limit, and even causes noises, vibrations and heat easily.
All of the aforementioned factors make it difficult to achieve the required heat dissipating effect.
In view of the description above, there are limitations on the breakthrough of the improvement of fan performance, heat dissipating effect, and temperature drop.
However, the heat absorbing surfaces of the foregoing water block is concentrated at the same spot, and thus only a portion of the coolant entering into the water block can have a heat exchange at the heat absorbing surface, and the staying time of the coolant in the water block is too short.
As a result, the coolant will flow out from another pipe before the coolant absorbs enough heat from the heat source, and the effect of the water-cooling heat dissipation will become very limited.
However, the space available in the unidirectional channels 103 is not close enough, and thus the coolant will pass through the unidirectional channels 103 too quickly, and its staying time cannot be improved.
As a result, the coolant cannot achieve the effect of absorbing enough heat of the heat source which is absorbed by the heat sinks 102, nor enhancing the heat dissipating effect.

Method used

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Embodiment Construction

[0028] The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings. However, the drawings are provided for reference and illustration only and are not intended for limiting the scope of the invention.

[0029] Referring to FIG. 2, a water block body 1 of the invention comprises a first casing 11 and a second casing 12 engaged with each other to form a hollow sealed box body, and the shape of the water block body 1 can be varied appropriately according to different requirements. The first casing 11 and the second casing 12 of this embodiment are cuboids (but not limited to such arrangement) made of a metal material or a ceramic material. The first casing 11 and the second casing 12 are coupled by soldering, riveting or binding. In addition, the first casing 11 has a water inlet pipe 111 and a water outlet pipe 112 extended outward (or u...

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Abstract

In a water block and its manufacturing method, a porous microchannel structure adopts a first casing and a second casing to form a water block. Water inlet and outlet pipes are extended from both ends of the first casing respectively. The second casing has a porous microchannel structure made by sintering a heat conducting powder and formed on an internal side of the second casing. The second casing has a contact surface on its external side for absorbing and conducting a heat source to the porous microchannel structure, such that a coolant can flow from the water inlet pipe into the water block. The porous microchannel structure produces turbulent flows to the coolant, so as to extend the staying time of the coolant in the water block, and allow the coolant to fully exchange heat with the porous microchannel structure and flow out from the water outlet pipe.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a water-cooling heat dissipating structure and its manufacturing method, and more particularly to a water block applicable for electronic components and its manufacturing method. [0003] 2. Description of Prior Art [0004] The operation of any electric appliance may cause overheats inevitably due to the issue of efficiency or friction. Particularly, products produced by manufacturers of the present technological industry such as integrated circuits and personal electronic products tend to be developed with a high precision. Besides the minimization of volume, these products (particularly computers) also produce increasingly more heat. Since the operation performance of these products is enhanced continuously, the overall heat quantity produced by computes is also increased accordingly, and the main heat source no longer limits to CPU only, but high-speed devices including chip modules,...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B21D53/02F28F13/06F28F9/22
CPCF28F3/12F28F13/003F28F21/04F28F21/08F28F2260/02Y10T29/4935F28F2255/18H01L2924/0002H01L23/473H01L2924/00
Inventor PENG, YU-HUANG
Owner COOLER MASTER CO LTD
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