Pad, system and method for polishing, buffing, compounding and glazing
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[0019]Applicant now describes in detail embodiments of the claimed invention. The described embodiments are examples. This detailed description is not intended to limit the scope of the invention as claimed.
[0020]FIG. 1 shows an example of a system according to the claimed invention. In FIG. 1, surface-treatment pad 10 has: working pad 20 with central aperture 22 and front surface 24; insert 18 with threaded central aperture 19; first carrier layer 14A disposed between the rear surface of working pad 20 and said insert 18; first affixing layer 16A disposed between said first carrier layer 14A and said rear surface of said working pad 20; and second affixing layer 16B disposed between said insert 18 and said first carrier layer 14A so as to fix said insert 18 to said first carrier layer 14A. Surface-treatment pad 10 further has: second carrier layer 14B disposed upon the side of said insert 18 opposite said working pad 20; and third affixing layer 16C disposed between said second car...
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