Polishing method and polishing apparatus

a polishing apparatus and polishing method technology, applied in the direction of manufacturing tools, cleaning using liquids, abrasive surface conditioning devices, etc., can solve the problems of difficult to completely remove foreign matter adhering to the polishing member, uneven rubbing of the polishing member with a brush, and difficult to remove foreign matter from the polishing member, etc., to achieve the effect of preventing foreign matter adhesion

a polishing apparatus and polishing method technology, applied in the direction of manufacturing tools, cleaning using liquids, abrasive surface conditioning devices, etc., can solve the problems of difficult to completely remove foreign matter adhering to the polishing member, uneven rubbing of the polishing member with a brush, and difficult to remove foreign matter from the polishing member, etc., to achieve the effect of preventing foreign matter adhesion

US20070232203A1Inactive Publication Date: 2007-10-04EBARA CORP
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  • Polishing method and polishing apparatus
  • Polishing method and polishing apparatus
  • Polishing method and polishing apparatus

Examples

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Embodiment Construction

[0107]Preferred embodiments of the present invention will now be described with reference to the drawings.

[0108]At the outset, the terms “foreign matter adhesion position” and “foreign matter adhesion area”, in a surface of a polishing member, such as a polishing pad, to which foreign matter is adhering, will be described with reference to FIGS. 1A and 1B. In general, a polishing member, such as a polishing pad, is not in a fixed or stationary state during polishing, but is making a rotational movement in the case of a rotary polishing member 200, as shown in FIG. 1A, or a linear movement in the case of an endless belt-type polishing member 202, as shown in FIG. 1B.

[0109]The term “foreign matter adhesion position” refers to the exact position of adherent foreign matter in a surface of a polishing member. Thus, as shown in FIG. 1A, when a fixed reference coordinate system (polar coordinate system is illustrated in the Figure) is taken on the surface of the rotary polishing member 200...

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Abstract

A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering of the yield even when the polishing object is large-sized. The polishing method includes: specifying a foreign matter adhesion position or a foreign matter adhesion area in a surface of the polishing member; and intensively cleaning the foreign matter adhesion position or the foreign matter adhesion area in the surface of the polishing member.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a polishing method and a polishing apparatus for polishing optical components, machine components, ceramics, metals, etc., a program for carrying out the polishing method, and a storage medium storing the program, and more particularly to a polishing method and a polishing apparatus which are suitable for polishing a polishing object, such as a semiconductor wafer, into a flat mirror-like surface, a program for carrying out the polishing method, and a storage medium storing the program.[0003]2. Description of the Related Art[0004]With the recent progress toward higher integration of semiconductor devices, circuit interconnects are becoming finer and the sizes of devices integrated are becoming smaller. The manufacturing of such semiconductor devices necessitate a process of removing by polishing a film formed in a surface of a semiconductor wafer, thereby flattening the surface. There ar...

Claims

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Application Information

Patent Timeline
04 Oct 2007
Publication
US20070232203A1
IPC
B24B1/00
CPC
B08B1/04; H01L21/67219; B24B53/017; B08B3/02; B08B1/32
Inventors
FUKUDA, AKIRA; HIYAMA, HIROKUNI