Cooling Apparatus of Looped Heat Pipe Structure

Abstract

A coolant phase changeable cooling apparatus using a capillary action is provided. The cooling apparatus prevents a generation of bubbles inside a wick of an evaporator or an inverse flow of a vaporized gaseous coolant through a wick. Also, a thermal contact area can be widened by using at least one groove of a gaseous coolant flow passage unit. Based on these provided effects, cooling efficiency of the cooling apparatus can be improved.

Description

TECHNICAL FIELD [0001] The present invention relates to a coolant phase changeable cooling apparatus using a capillary action, and more particularly, to a cooling apparatus which widens heat contact areas of a porous member, into which a liquid coolant is filled by adhesiveness of an internal capillary tube of an evaporator, and the filled liquid coolant and includes a groove which gives fluidity of a vaporized coolant. BACKGROUND ART [0002] As the integration scale of semiconductor devices has been increased, a higher level of heat has been given off per unit area of a semiconductor chip. This increasing heat emission causes degradation of reliability of a system utilizing semiconductor devices. [0003] Hence, cooling technology has been developed to solve the above disadvantage related to the increasing heat emission. One typical cooling method is to use latent heat of a coolant and is advantageous in respect of cooling efficiency, manufacturing costs and installation spaces. That ...

AI Technical Summary

Benefits of technology

[0011] It is, therefore, an object of the present invention to provide a cooling apparatus with a looped heat pipe structure which improves a cooling function by preventing a generation of bubbles inside a wick of an evaporator or an inverse flow of a vaporized gaseous coolant through the wick.

Problems solved by technology

This increasing heat emission causes degradation of reliability of a system utilizing semiconductor devices.

Thus, if heat is not sufficiently absorbed from the external heat emitter when a cooling apparatus first operates, there may be a disadvantage that cooling capability is diminished because of the insufficient operation power for circulating the coolant.

Another cooling method of improving the aforementioned disadvantage is the use of a capillary pumped loop (CPL) type cooling apparatus.

However, this improved conventional cooling method still has limitations.

The inverse flow may cause a decrease in the thermal transfer efficiency of the cooling apparatus and increase the manufacturing costs.

The synthetic resin-based substance has a low ignition point and a high degree of thermal transformation and thus, the latter mentioned conventional cooling method may not be used when a brazing process is performed for fabricating an evaporator.

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