Thermoelectric conversion module and method for manufacturing the same

Abstract

A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a thermoelectric conversion module and a method for manufacturing the thermoelectric conversion module, and more particularly, to an improvement in a method for manufacturing a compact, high-performance thermoelectric conversion module.[0003]2. Description of the Related Art[0004]Conventional techniques relating to the present invention are disclosed in Japanese Unexamined Patent Application Publication No. 8-153899 and Japanese Unexamined Patent Application Publication No. 8-222770.[0005]Japanese Unexamined Patent Application Publication No. 8-153899 discloses a thermoelectric conversion module including an insulating frame having a plurality of through-holes spaced from each other. The through-holes contain p-type or n-type compound semiconductor elements. The through-holes containing the p-type compound semiconductor elements and the through-holes containing the n-type compound semico...

AI Technical Summary

Benefits of technology

[0023]Preferably, at least one of a p-type thermoelectric semiconductor and an n-type thermoelectric semiconductor includes a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other and the portions are distributed in the stacking direction of a laminate. Thus, a cascade structure can be achieved and high thermoelectric conversion efficiency can be obtained over a specific temperature range.

[0024]When both of the p-type thermoelectric semiconductor and the n-type thermoelectric semiconductor include the portions in which the peak temperatures of thermoelectric figures of merit are different from each other, the thermoelectric conversion module has an improved thermoelectric conversion efficiency.

[0027]The thermoelectric conversion module-manufacturing method enables the thermoelectric semiconductors, which correspond to such via-conductors, to be densely arranged in the laminate. Therefore, the thermoelectric conversion module can be readily manufactured so as to have a small size and high performance.

[0028]The wiring conductors and the thermoelectric conversion element pairs, as well as the multilayer circuit board, can be flexibly designed. Thus, the thermoelectric conversion module can be readily manufactured so as to have desired characteristics.

[0029]According to the thermoelectric conversion module-manufacturing method, the thermoelectric semiconductors are formed such that the perforations are formed in the insulating sheets, the thermoelectric semiconductor material is packed into the perforations, and the insulating sheets are then stacked. Therefore, one of the thermoelectric semiconductors is not misaligned with another one thereof. This enables the thermoelectric conversion module to be protected from electrical faults or short circuits.

[0031]If the insulating sheets are green ceramic sheets and a step of firing the laminate is performed subsequently to a stacking step in the thermoelectric conversion module-manufacturing method according to preferred embodiments of the present invention, the thermoelectric conversion module can be manufactured through steps substantially identical to those of a method for manufacturing a conventional multilayer ceramic circuit board. The commonality of manufacturing facilities allows the thermoelectric conversion module to be manufactured at low cost.

Problems solved by technology

Thus, the element has relatively low thermoelectric conversion efficiency.

This prevents the thermoelectric semiconductors and the wiring conductors from being properly electrically connected to each other.

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