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Epoxy silicone and process for producing same, and curable mix composition using same and use thereof

Active Publication Date: 2010-05-13
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0061]According to the present invention, it is possible to provide epoxy silicone having transparency, light resistance, heat resistance, heat discoloration resistance, crack resistance and adhesiveness, and suitable for use in a sealing material for a light-emitting device; a curable mix composition for sealing a light-emitting device, containing the epoxy silicone, and a light-emitting component such as light-emitting diode, formed of the resin composition and having excellent adhesiveness between a device and a packaging material, free of occurrence of a crack and capable of suppressing a decrease in brightness for a long time.
[0018]It is another object of the present invention is to provide a curable mix composition suitable for injecting molding, and capable of providing a rigid material after hardened and also excellent in dimensional stability, suitable for a lens material.

Problems solved by technology

Conventional compositions containing an epoxy resin, such as bisphenol A-based epoxy resin and bisphenol F-based epoxy resin, as a main component, actually do not have sufficient properties.
However, the epoxy silicone formed of a T structure as a main component is brittle and therefore, it is difficult to satisfy crack resistance required for a light-emitting device sealing material.
However, these specifications describe nothing about optical uses thereof such as optical semiconductors.
However, these specifications describe nothing about application to optical uses thereof such as optical semiconductors.
However, the resin composition is insufficient in light resistance.
The crack resistance and adhesiveness thereof do not reach satisfactory levels.

Method used

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  • Epoxy silicone and process for producing same, and curable mix composition using same and use thereof
  • Epoxy silicone and process for producing same, and curable mix composition using same and use thereof
  • Epoxy silicone and process for producing same, and curable mix composition using same and use thereof

Examples

Experimental program
Comparison scheme
Effect test

example 1

Production of [Epoxy Silicone-1a]

[0346]A 3 L reactor with a reflux condenser, a thermometer and a stirrer was purged with dry nitrogen. Under dry nitrogen conditions, the reactor was charged with 80 g of 1,3,5,7-tetramethylcyclotetrasiloxane (a reagent manufactured by Shin-Etsu Chemical Co., Ltd.) dehydrated, distillated and purified under dry nitrogen; 37.2 g of 1,3-divinyltetramethyldisiloxane (a reagent manufactured by Shin-Etsu Chemical Co., Ltd.) dehydrated, distillated and purified under dry nitrogen; 122.6 g of 4-vinylcyclohexcene oxide (a reagent manufactured by Aldrich) dehydrated, distillated and purified under dry nitrogen, and 925 g of 1,4-dioxane (a reagent manufactured by Wako Pure Chemical Industries Ltd.) dehydrated, distillated and purified under nitrogen. Thereafter, the mixture was heated in an oil bath increased to 70° C. while stirring under an atmospheric-pressure dry nitrogen atmosphere.

[0347]After the temperature of the interior solution exceeded 65° C., a 1,...

example 2

Production of [Epoxy Silicone-2a]

[0357]A 3 L reactor with a reflux condenser, a thermometer and a stirrer was purged with dry nitrogen. Under dry nitrogen conditions, the reactor was charged with 80 g of 1,3,5,7-tetramethylcyclotetrasiloxane (a reagent manufactured by Shin-Etsu Chemical Co., Ltd.) dehydrated, distillated and purified under dry nitrogen; 37.2 g of 1,3-divinyltetramethyldisiloxane (a reagent manufactured by Shin-Etsu Chemical Co., Ltd.) dehydrated, distillated and purified under dry nitrogen; 122.6 g of 4-vinylcyclohexcene oxide (a reagent manufactured by Aldrich) dehydrated, distillated and purified under dry nitrogen and 925 g of ethylene glycol dimethyl ether (a reagent manufactured by Aldrich). Thereafter, the mixture was heated in an oil bath increased to 83° C. while stirring under an atmospheric-pressure dry nitrogen atmosphere.

[0358]An ethylene glycol dimethyl ether solution (5.6 g) of a platinum divinyltetramethyldisilicone complex containing 500 ppm of plati...

example 3

Production of [Epoxy Silicone-3a]

[0368][Epoxy silicone-3a] (195 g) reduced in low boiling-point compounds was obtained in the same manner as in Example 1 except that, in the hydrosilylation reaction, 1,3-divinyltetramethyldisiloxane (55.8 g) was used; 4-vinylcyclohexene oxide (97.6 g) was used; 1,4-dioxane (900 g) was used; the 1,4-dioxane solution (3.6 g) of a platinum divinyltetramethyldisilicone complex containing 500 ppm of platinum in terms of platinum element was used; and after the hydrosilylation reaction, the solution was cooled, and thereafter, acetonitrile (900 g) was added.

[0369]Immediately before termination of the hydrosilylation reaction, a sample was taken. As a result, the hydrosilylation reaction was found to proceed quantitatively and an unreacted SiH unit was not detected.

[0370]At the initiation of the reaction, the ratio (r2 / r1), which is the ratio of the total number of mole (r1) of the SiH unit of organohydrogensilicone to the number of mole (r2) of the carbon...

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Abstract

An epoxy silicon, which comprises at least a compound represented by the following general formula (1), and a compound represented by the following general formula (2); and which is represented by an average composition formula (3), wherein a value of [g / (a+b+c+d+e+f+g+h+i+j)] falls within a range of 0.020 or less.

Description

TECHNICAL FIELD[0001]The present invention relates to epoxy silicone suitably used as a main component of a curable mix composition for use in light-emitting device sealing materials, lenses, and the like.BACKGROUND ART[0002]Conventionally, an epoxy resin composition using an acid anhydride-based hardening agent provides a transparent hardened material and has been suitably used as a sealing material for light-emitting devices having high heat resistance, such as light-emitting diodes and photodiodes. However, with recent development of high-performance optical semiconductors, a hardened material, which has not only good transparency and high heat resistance but also excellent light resistance, oxidation resistance and crack resistance at the time of a hot and cold cycle in accordance with the on / off cycle of an LED, has been required as a sealing resin. Conventional compositions containing an epoxy resin, such as bisphenol A-based epoxy resin and bisphenol F-based epoxy resin, as a...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08G77/04
CPCC08G59/306C08G59/3254C08G77/14C08G77/38C08G77/50C08L63/00H01L2924/0002C08L83/06C08L83/14H01L23/296H01L2924/00C08G77/06G02B1/04
Inventor KURODA, YOSHITOYOKOYAMA, MASAKOODA, HIROJI
Owner ASAHI KASEI CHEM CORP
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