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Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same

a technology of joining layer and metal, which is applied in the direction of manufacturing tools, solvents, solvents, etc., can solve the problems of inability to generally employ au-based alloy solder, inability to use high-temperature solder, and inability to use zn-based alloy jointing materials, etc., to achieve excellent mechanical strength

Inactive Publication Date: 2010-09-30
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a joint with excellent mechanical strength under high temperature conditions using a jointing material that does not contain harmful Pb component and Au component. The joint is formed by a method that involves preparing the first and second members to be jointed, forming an Sn film on at least one of the members, and pressing the members through the Sn film. The joint includes a metallic material with a melting point higher than the melting point of Sn metal. The technical effect of this invention is to provide a safer and stronger joint for various applications that require high temperature resistance.

Problems solved by technology

However, it is urgently desired to develop a non-Pb based solder without Pb component because the Pb component contained in the Sn—Pb based eutectic solder is harmful to humans.
In view of the cost of the Au component which belongs to noble metal, it is difficult to generally employ the Au-based alloy solder.
Then, although another metallic alloy solder containing another main component except the Pb component and the Au component is developed, the fungible metallic alloy solder does not come into practical use as the high temperature solder.
However, since the Zn-based alloy jointing material can not exhibit the wettability for a Cu member, and is too hard to be employed as the jointing material, the Zn-based alloy jointing material does not comes into practical use.
The Sn-based alloy jointing material can exhibit good jointing characteristics and hardness enough to be processed, but can not exhibit the thermal resistance enough to be applied as the high melting temperature type solder because the Sn-based alloy jointing material is liquefied at a lower temperature.

Method used

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  • Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same
  • Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same
  • Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

Joints

[0019]An attention is paid to the fact of the matter that the intended joints with higher thermal resistance can be obtained by reacting or alloying Sn metal of a melting point of 232 degrees centigrade with a metallic material of a higher melting point than the Sn metal, and thus, forming an intermetallic compound or an alloy with higher melting point so as to join members to be jointed. In this point of view, the present invention can be established.

[0020]Namely, as illustrated in FIG. 1, in this embodiment, the joints 10 includes a first member 11 to be jointed, a second member 12 to be jointed and a jointing layer 13 intervened between the members 11 and 12.

[0021]The jointing layer 13 is composed of three layers 13a, 13b and 13c which are made of intermetallic compounds. The intermatallic compound layer 13a is composed of the metallic component of the first member 11 and the metallic component of the jointing material disposed between the members 11 and 12 at the joint the...

second embodiment

Jointing Method

[0050]In the jointing method according to this embodiment, the jointing material is disposed between the members to be jointed and heated so as to be reacted or alloyed. The jointing material contains the Sn metal (first metallic component) and the metallic material (second metallic component) with a higher melting point than the Sn metal.

[0051]In the jointing method, the second metallic component may be made of the metallic element(s) of the member(s) to be jointed. Namely, the first metallic component (Sn metal) is disposed between the members to be jointed so that the first metallic component is reacted or alloyed with the metallic element(s) of the member(s) to form the corresponding jointing layer.

[0052]According to the jointing method, only the first metallic component is required to be formed filmy and the second metallic component is not required to be prepared. In addition, the joint between the members and the jointing layer can be strengthened.

[0053]Then, t...

third embodiment

Modified Jointing Method

[0062]In the second embodiment, the second metallic component may be made of the metallic element(s) of the member(s) to be jointed. In this embodiment, in contrast, the second metallic component is formed filmy in the same manner as the first metallic component.

[0063]Namely, according to this embodiment, the Sn film and the metallic material film with a higher melting point than the Sn metal are formed on the first member to be jointed, respectively, and then, are contacted with the second member to be jointed. Concretely, the metallic material film is contacted with the second member. The thus obtained laminated body is heated within a temperature range of 250 to 450 degrees centigrade so that the metallic material film is pressed against the second member.

[0064]In this embodiment, the first metallic component and the second metallic component of the jointing material may be formed as foils on the first member to be jointed. The foils are disposed on the fi...

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Abstract

The present invention relates to a joint (10) that includes a first member (11) to be jointed, a second member (12) to be jointed and a jointing layer (13) located between the first member (11) and the second member (12). The jointing layer (13) is made of Sn metal and a metallic material with a melting point higher than the melting point of the Sn metal. The present invention relates also to a method of joining this first member (11) to the second member (12).

Description

[0001]The present invention relates to a joint which is preferably employed for an electronic device and a method for forming the joints.BACKGROUND ART[0002]Conventionally, solder joint used to be widely employed for the electric connection for an electric device or an electronic device. In the conventional solder joint, Sn—Pb based eutectic solder is often used because the eutectic solder is suitable in view of practical use. However, it is urgently desired to develop a non-Pb based solder without Pb component because the Pb component contained in the Sn—Pb based eutectic solder is harmful to humans.[0003]On the other hand, at present, as a jointing material to be used in a semiconductor device such as a semiconductor power device, a low temperature solder (Sn—Pb eutectic solder) with a melting point of 183 degrees centigrade and a high melthing temperature type solder (Pb-5Sn based solder) with a melting point of about 300 degrees centigrade are often employed depending on the cor...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B15/01B23K31/02
CPCB23K1/0016B23K1/19B23K35/262B23K35/3006B23K35/302H01L24/83Y10T428/12708H01L2924/01322H01L2924/1301H01L2224/83Y10T428/12722Y10T428/12715H01L2924/00H01L2924/15747
Inventor TAKAHASHI, TOSHIHIDEKONO, TATSUOKIOKI, MITSUHIROSUZUKI, AKIKO
Owner KK TOSHIBA