Real time monitoring of indium bump reflow and oxide removal enabling optimization of indium bump morphology

Abstract

A method, apparatus, system, and device provide the ability to form one or more solder bumps on one or more materials. The solder bumps are reflowed. During the reflowing, the solder bumps are monitored in real time. The reflow is controlled in real time, thereby controlling a morphology of each of the solder bumps. Further, the wetting of the solder bumps to a surface of the materials is controlled in real time.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit under 35 U.S.C. Section 119(e) of the following co-pending and commonly assigned U.S. Provisional Patent Application:[0002]U.S. Provisional Patent Application Ser. No. 61 / 294,754 filed on Jan. 13, 2010, by Todd J. Jones, Shouleh Nikzad, Thomas J. Cunningham, Edward R. Blazejewski, Matthew R. Dickie, Michael E. Hoenk and Harold Greer, entitled “REAL TIME MONITORING OF INDIUM BUMP RELFOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY” attorney's docket number 176.61-US-P1 (CIT-5524P), which application is incorporated by reference herein.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT[0003]The invention described herein was made in the performance of work under a NASA Contract, and is subject to the provisions of Public Law 96-517 (35 U.S.C. 202) in which the Contractor has elected to retain title.BACKGROUND OF THE INVENTION[0004]1. Field of the Invention[0005]The prese...

AI Technical Summary

Benefits of technology

[0014]The materials may include one or more metal electrical contact pads that are lithographically patterned on a device, and the solder bumps may be at least partially positioned on the surfaces of the one or more metal electrical contact pads. The controlling may correct for imperfect alignment of the solder bumps relative to the one or more metal electrical contact pads.

[0015]The controlling may achieve the solder bumps that are contained on the one or more metal electrical contact pads.

Problems solved by technology

While indium bump technology has been a part of the electronic interconnect process field for many years, and has been extensively employed in the infrared imager industry, obtaining a reliable, high yield process for high density patterns of bumps can be quite difficult.

One problem is the tendency of the indium bumps to oxidize during exposure to air.

Occasionally, errors in the patterning process lead to misaligned or misshapen bumps.

This is undesirable as it may affect the reliability of the electrical connection.

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