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Cardboard-Box-Free Packaging Of Solid Yeast Products

a solid yeast and carton-free technology, applied in the field of carton-free packaging of solid yeast products, can solve the problems of affecting the quality of the product, the degradation of the microbiological quality and performance of the yeast product, and the impact of yeast metabolism level on the product, so as to improve the cooling effect of the solid yeast product, reduce the risk of product contamination, and maintain the organoleptic quality of the bread-making product

Inactive Publication Date: 2013-01-03
LESAFFRE & CIE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a package of solid yeast products that can be cooled during storage while reducing the risk of contamination. This is achieved by providing a lower level of thermal insulation and allowing better cooling without the need for cooling passages. The invention also eliminates the risk of contamination from the use of adhesive to bond the product batches to the pallet. Additionally, the package allows for better protection of the environment than traditional cardboard packaging.

Problems solved by technology

Yeast products, notably those available in solid form (particularly compressed yeast), are particularly sensitive to their storage conditions, notably the temperature, and are particularly exposed to contamination.
In fact, the storage of solid yeast products in inappropriate conditions, or changes in the storage conditions, may have effects on yeast metabolism level.
This may lead to a degradation of the microbiological quality and the performance (notably in terms of fermentation power) of the yeast products, and therefore a degradation of the organoleptic qualities of the bread-making products obtained from them.
Since cardboard is a good thermal insulator, the method of packaging solid yeast products used at present has the drawback of not allowing completely satisfactory cooling of the solid yeast products.
However, this leads to risks of contamination of the products.
Furthermore, the degree of cooling of the solid yeast products is not entirely satisfactory.

Method used

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  • Cardboard-Box-Free Packaging Of Solid Yeast Products
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  • Cardboard-Box-Free Packaging Of Solid Yeast Products

Examples

Experimental program
Comparison scheme
Effect test

example 1

Monitoring the Temperature on the Packages According to the Invention

[0130]1. Material

[0131]In this test, two packages according to the invention were used, and the variation of the local temperature inside the packages was measured by means of temperature probes while the packages were stored in a cold chamber.

[0132]The first package conforms to FIGS. 1 and 2, with a plastic support element. The package comprises five layers of ten batches, the batches which may comprise six packs each (in three rows of two packs). The packs of a batch are tied together by four crossed bands. Each pack comprised five solid yeast products, and had a weight of approximately 2.5 kg. Spaces were organized between the batches (cooling passages).

[0133]The second package was identical to the first, but had no cooling passages. In other words, the batches were tightened to one another.

[0134]The two packages were each provided with an outer covering composed of plastic film, covering the batches completely....

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Abstract

The invention relates to packaging (10) for solid yeast products, such as: a supporting element (12); solid yeast products contained in one or more packages (22), supported by the supporting element (12); and an outer cover (14) retaining all of the solid yeast products contained in the packages (22) on the supporting element (12). According to the invention, all of the packages (22) located between the solid yeast products and the outer cover (14) may have a surface density no greater than 200 g / m2. The invention also relates to a method for packaging solid yeast products and to a method for preserving and using solid yeast products thus packaged.

Description

RELATED APPLICATIONS AND INCORPORATION BY REFERENCE[0001]This application is a continuation-in-part application of international patent application Serial No. PCT / IB2010 / 055727 filed 10 Dec. 2010, which published as PCT Publication No. WO 2011 / 073869 on 23 Jun. 2011, which claims benefit of French patent application Serial No. 09 / 58921 filed 14 Dec. 2009.[0002]The foregoing applications, and all documents cited therein or during their prosecution (“appln cited documents”) and all documents cited or referenced in the appln cited documents, and all documents cited or referenced herein (“herein cited documents”), and all documents cited or referenced in herein cited documents, together with any manufacturer's instructions, descriptions, product specifications, and product sheets for any products mentioned herein or in any document incorporated by reference herein, are hereby incorporated herein by reference, and may be employed in the practice of the invention. More specifically, all r...

Claims

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Application Information

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IPC IPC(8): B65D81/18B65B3/04A23L1/28
CPCB65D71/0096B65D81/24B65D81/18B65D77/042A23L31/10A23V2002/00B65B5/06B65B13/02B65B63/02B65D81/267C12N1/04C12N1/16
Inventor CHASSARD, JEAN-PIERRELACROIX, STEPHANESTADLER, BERNARDSCHNEIDER, SOPHIE
Owner LESAFFRE & CIE
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